Multistage vibration isolation system and method for precise instrument

Abstract

The invention provides a multi-stage vibration isolation system for a precise instrument, first deep groove vibration isolation trenches are annularly arranged in a foundation, and the first deep groove vibration isolation trenches are used for dividing the foundation into an outer foundation and an inner foundation; a precise instrument is arranged on the inner foundation, and the first deep groove vibration isolation trenches are filled with the first vibration isolation medium, so that vibration reduction is performed in multiple aspects, vibration excited by a moving part and ground low-frequency random vibration can be decoupled, and vibration on the main substrate is reduced from a vibration source by blocking a transmission path of disturbance force of the moving part. Different high-damping vibration isolation materials are selected as first vibration isolation media according to broadband vibration and narrow-band vibration, the first deep groove vibration isolation grooves are filled in a series connection mode so as to meet the high-precision requirement for silicon wafer positioning, in this way, moving parts and the main substrate are separated through the vibration isolators, vibration sources can be reduced, vibration is greatly reduced, and the motion positioning precision of a silicon wafer in a photoetching machine is improved.

Description

technical field [0001] The invention relates to the technical field of precision equipment, and more specifically, to a multi-stage vibration isolation system and method for precision instruments. Background technique [0002] The lithography machine is a precision equipment with nanometer precision, and the vibration reduction and isolation technology is the key technology in the system design of the lithography machine. The source of vibration in the lithography machine is mainly the low-frequency vibration from the ground, as well as the vibration excited by the moving parts and water vapor parts during the work process. In the existing lithography machine, the moving parts are supported by air springs and placed directly on the ground, and the moving parts and the frame are connected through a pin-fitted mechanical interface. In order to isolate the low-frequency vibration of the ground, the technical solution usually adopted To use three to four active isolators connec...

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Problems solved by technology

[0005] In view of the above problems, the purpose of the present invention is to provide a multi-stage vibration isolation system and method for precision instruments to solve the problem of using active vibration isolators in the prior art to move The components are separated from the main substrate, but due to the limitation of the vibration isolation rate, the active vibration isolator can only reduce the vibration but cannot completely isolate the vibration. The two paths of the mechanical interface and the mechanical interface are transmitted to the installation position of the active vibration isolator, so that the vibration on the main substrate after being attenuated by the active vibration isolator is still too large, resulting in the problem that the movement positioning accuracy of the silicon wafer in the lithography machine cannot meet the index requirements

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