Chip extraction device and chip extraction method

Abstract

The invention relates to a chip extraction device and a chip extraction method. In the chip extraction device, a vacuum adsorption head comprises a cavity and a camera arranged in the cavity, a vacuum extraction opening is formed in the cavity wall of the cavity, the cavity is provided with an opening used for adsorbing a target chip, and the camera is arranged towards the opening of the cavity. By utilizing the chip extraction device, the position of the target chip can be confirmed and aligned by utilizing the camera before the cavity adsorbs the target chip, and the cavity does not need to move in a large range after alignment, so that the chip extraction accuracy and the extraction position precision are improved. According to the chip extraction method, the target chip is extracted by adopting the chip extraction device, and the cavity is only in contact with the peripheral area of the target chip, so that pollution or damage to the graphic area of the chip caused by extraction operation can be avoided, subsequent process defects can be reduced, and the yield of chip products is improved.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a chip extraction device and a chip extraction method. Background technique [0002] In semiconductor technology, chips are usually manufactured in batches based on the wafer process. Many chips are designed on the same wafer. After the wafer process is completed, the wafer is cut into individual chips (die), and the cut chips are then Separately pick up (pick up) for subsequent packaging process. Taking the chip-wafer bonding technology as an example, in this technology, a plurality of diced dies are transferred to another semiconductor wafer, and the transferred dies are bonded to the semiconductor wafer to realize packaging. [0003] At present, the device used in the industry to extract chips first drives a special lens to scan the area where the chip is placed, and reads the alignment mark on the target chip to be captured. The control module determines the position a...

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Problems solved by technology

[0004] The above-mentioned device for extracting chips has the following problems: 1. The chip extracting component designs a moving route based on the target chip position to grab the chip after the lens obtains the target chip position, and no longer moves after the moving route is designed and before grabbing the chip. For position confirmation, due to errors or faults, there is an uncertain deviation between the actual position of the chip extraction component and the actual position of the target chip, making the accuracy of chip extraction and the accuracy of the extraction position unguaranteed; 2. Due to the small size of the chip, And there may be position deviation. At present, when the chip extraction component grabs the chip, it will directly contact the graphics area on the front of the chip. During the grabbing and transfer process, it is easy to pollute or even damage the graphics area of ​​the chip, which will reduce the cost of the subsequent packaging process. Yield

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