Systems and methods for multi-level pulsing in RF plasma tools

Abstract

Systems and methods for multi-level pulsing are described. The systems and methods include generating four or more states. During each of the four or more states, a radio frequency (RF) generator generates an RF signal. The RF signal has four or more power levels, and each of the four or more power levels corresponds to the four or more states. The multi-level pulsing facilitates a finer control in processing a substrate.

Description

technical field [0001] Embodiments of the invention relate to systems and methods for multi-stage pulsing in radio frequency (RF) plasma tools. Background technique [0002] The background description provided herein is for the purpose of generally presenting the context of the disclosure. The work of the presently named inventors is neither expressly nor impliedly admitted to be prior art to the present disclosure to the extent that it is described in this Background section and in aspects of the specification that cannot be determined to be prior art at the time of filing. technology. [0003] In a plasma tool, one or more radio frequency (RF) generators are coupled to an impedance matching circuit. An impedance matching circuit is coupled to the plasma chamber. The RF signal is supplied from the RF generator to the impedance matching circuit. The impedance matching circuit outputs RF signals upon receiving these RF signals. The RF signal is supplied from the impedanc...

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However, the wafer was not processed to the desired level of detail

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