Systems and methods for multi-level pulsing in RF plasma tools

A plasma and level technology, applied in the direction of pulse technology, pulse generation, electric pulse generation, etc., can solve the problem that the wafer has not been processed to the detail level, and achieve the effect of increasing the control level and allowing control

Pending Publication Date: 2022-02-11
LAM RES CORP
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  • Application Information

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However, the wafer was not proces

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  • Systems and methods for multi-level pulsing in RF plasma tools
  • Systems and methods for multi-level pulsing in RF plasma tools
  • Systems and methods for multi-level pulsing in RF plasma tools

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[0113] The following embodiments describe multi-stage pulse systems and methods in radio frequency (RF) plasma tools. It will be apparent that the embodiments herein can be implemented without having some or all of these specific details. In other situations, well-known processing operations are not described in detail to avoid unnecessarily unnecessarily make it difficult to understand.

[0114] In the following description, an embodiment of a number of multi-stage pulses is provided. Both or more of the embodiments described herein can be combined to operate, or each of the embodiments described herein can operate independently of each other to provide specific embodiments associated with multi-stage pulses.

[0115] This article describes the RF generator that promotes multi-stage pulse. The RF generator generates an RF signal having four or more power levels and provides the RF signal to an impedance matching circuit coupled to the electrode of the plasma chamber. The RF signa...

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Abstract

Systems and methods for multi-level pulsing are described. The systems and methods include generating four or more states. During each of the four or more states, a radio frequency (RF) generator generates an RF signal. The RF signal has four or more power levels, and each of the four or more power levels corresponds to the four or more states. The multi-level pulsing facilitates a finer control in processing a substrate.

Description

technical field [0001] Embodiments of the invention relate to systems and methods for multi-stage pulsing in radio frequency (RF) plasma tools. Background technique [0002] The background description provided herein is for the purpose of generally presenting the context of the disclosure. The work of the presently named inventors is neither expressly nor impliedly admitted to be prior art to the present disclosure to the extent that it is described in this Background section and in aspects of the specification that cannot be determined to be prior art at the time of filing. technology. [0003] In a plasma tool, one or more radio frequency (RF) generators are coupled to an impedance matching circuit. An impedance matching circuit is coupled to the plasma chamber. The RF signal is supplied from the RF generator to the impedance matching circuit. The impedance matching circuit outputs RF signals upon receiving these RF signals. The RF signal is supplied from the impedanc...

Claims

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Application Information

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IPC IPC(8): H01J37/32
CPCH01J37/32082H01J37/32146H01J37/32174H01J37/32183H03K3/017
Inventor 吴垠龙茂林约翰·德鲁厄里维克拉姆·辛格
Owner LAM RES CORP
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