Dispensing machine for semiconductor

Abstract

The invention relates to the technical field of semiconductor processing equipment, and particularly relates to a dispensing machine for a semiconductor. The machine comprises a machine body, a conveyor is mounted on the top surface of the machine body, a support is fixedly connected to the top of the machine body, a dispensing device is mounted on one side of the support, and a supporting sleeve is fixedly connected to the bottom surface of the dispensing device. And a glue dispensing column is slidably connected into the supporting sleeve, a plurality of glue dispensing pipes are arranged in the glue dispensing column, and the bottom surfaces of the glue dispensing pipes communicate with a glue dispensing nozzle. According to the invention, glue is pushed and injected through air pressure and moves to the glue dispensing nozzle through the glue dispensing pipes, the glue dispensing nozzle moves out of the supporting sleeve to achieve glue dispensing, after glue dispensing is finished, the glue dispensing column drives the glue dispensing pipe and the glue dispensing nozzle to return to the initial position under driving of the reset mechanism, and at the moment, the transmission mechanism drives the opening and closing mechanism to be closed to achieve the purpose that the glue dispensing nozzle is protected in the supporting sleeve; and the glue dispensing nozzle is protected, direct contact between the glue dispensing nozzle and the surface of a device is reduced, and the phenomenon of glue wire drawing is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors. Background technique [0002] When processing semiconductor devices, different semiconductor materials are glued after being coated with glue on the surface of the materials by a glue dispenser. In the prior art, when a glue dispenser is used to drip glue on semiconductor devices, because part of the glue is relatively viscous and fluid, When the dispensing tube moves up and down, the glue dripping on the semiconductor device and the glue inside the dispensing tube are not easy to separate quickly, and the glue drips down under the gravity to form a wire drawing phenomenon, and it is easy to drip on the non-dispensing position of the semiconductor device, affecting The use of semiconductor devices increases semiconductor defective products, and in the process of dispensing, air is easy to seep into the dispensing tub...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a glue dispenser for semiconductors, which pushes the glue in the glue cartridge through the air pressure inside the glue dispenser, so that the glue is injected onto the top surface of the glue dispensing column, and the air pressure continues to inject The glue makes the glue move down the dispensing tube to the inside of the dispensing nozzle. Since the dispensing column is not a hollow tubular structure, and the inside of the dispensing column is embedded in a fixed dispensing tube with multiple bends in the middle, it is convenient for the glue to squeeze the dispensing column. When the top surface moves to the dispensing tube, the dispensing column moves down along the inner wall of the support sleeve with the dispensing nozzle, so that the dispensing nozzle can be moved out of the dispensing, and multiple bends in the middle of the dispensing tube are also convenient to prevent fluid The glue falls by itself under the action of gravity and pollutes the conveyor. A connection block is fixedly connected to the inner wall of the support sleeve. The end of the connection block located in the accommodating cavity of the dispensing column is fixedly connected with a circular block 1 and a circular block 1. There is a return spring fixedly connected to the accommodation cavity. When the dispensing column moves down, the return spring is in a compressed state. As the glue in the dispensing nozzle drips onto the semiconductor device, the weight of the dispensing column is reduced, and the elastic force of the return spring Under the action, the dispensing column moves up with the dispensing tube and the dispensing nozzle and is stored in the support sleeve, which protects the dispensing nozzle, and is also conducive to reducing the direct contact between the dispensing nozzle and the surface of the device, keeping the outer wall of the dispensing nozzle clean and tidy, Reduce the phenomenon of glue drawing, and during the upward movement of the dispensing column, the top surface of the dispensing column will squeeze the glue on the top of the supporting sleeve, so that the glue on the top surface of the dispensing column and the glue inside the dispensing tube are in a full state, preventing direct air infiltration Inject glue, resulting in glue bubbling, which ensures the quality of dispensing;

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