Dispensing machine for semiconductor

A dispensing machine and semiconductor technology, which is applied to the device for coating liquid on the surface, pre-treating the surface, coating, etc., to achieve the effect of ensuring quality, reducing glue drawing, and keeping clean and tidy
CN114042601AActive Publication Date: 2022-02-15江苏卓远半导体有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江苏卓远半导体有限公司
Publication Date
2022-02-15

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Abstract

The invention relates to the technical field of semiconductor processing equipment, and particularly relates to a dispensing machine for a semiconductor. The machine comprises a machine body, a conveyor is mounted on the top surface of the machine body, a support is fixedly connected to the top of the machine body, a dispensing device is mounted on one side of the support, and a supporting sleeve is fixedly connected to the bottom surface of the dispensing device. And a glue dispensing column is slidably connected into the supporting sleeve, a plurality of glue dispensing pipes are arranged in the glue dispensing column, and the bottom surfaces of the glue dispensing pipes communicate with a glue dispensing nozzle. According to the invention, glue is pushed and injected through air pressure and moves to the glue dispensing nozzle through the glue dispensing pipes, the glue dispensing nozzle moves out of the supporting sleeve to achieve glue dispensing, after glue dispensing is finished, the glue dispensing column drives the glue dispensing pipe and the glue dispensing nozzle to return to the initial position under driving of the reset mechanism, and at the moment, the transmission mechanism drives the opening and closing mechanism to be closed to achieve the purpose that the glue dispensing nozzle is protected in the supporting sleeve; and the glue dispensing nozzle is protected, direct contact between the glue dispensing nozzle and the surface of a device is reduced, and the phenomenon of glue wire drawing is reduced.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors. Background technique

[0002] When processing semiconductor devices, different semiconductor materials are glued after being coated with glue on the surface of the materials by a glue dispenser. In the prior art, when a glue dispenser is used to drip glue on semiconductor devices, because part of the glue is relatively viscous and fluid, When the dispensing tube moves up and down, the glue dripping on the semiconductor device and the glue inside the dispensing tube are not easy to separate quickly, and the glue drips down under the gravity to form a wire drawing phenomenon, and it is easy to drip on the non-dispensing position of the semiconductor device, affecting The use of semiconductor devices increases semiconductor defective products, and in the process of dispensing, air is easy to seep into the dispensing tub...

Claims

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