Chain type lifting device for cleaning and drying chain type wafer

Abstract

The invention discloses a chain type lifting device for cleaning and drying chain type wafer, and relates to the technical field of wafer cleaning. The chain type lifting device for cleaning and drying the chain type wafer comprises a device main body, a transmission chain is arranged in the device main body, the transmission chain is arranged in a rectangular shape, and the inner sides of the four corners of the transmission chain are attached to four positioning wheels respectively. According to the chain type lifting device for cleaning and drying the chain type wafer, the cleaning long groove and the dryer are arranged at the bottom and the top of the conveying chain respectively, so that the wafer on the clamping piece can be cleaned and dried respectively; when the clamping piece moves in the cleaning long groove, the pushing strip is matched with a semicircular groove opening in the transmission chain so that the clamping piece can move up and down; the longitudinal movement of the wafer in the cleaning long groove is realized, and the contact effect of the wafer and the cleaning liquid in the cleaning long groove is enhanced; therefore, the cleaning effect of the wafer is improved, and the situation that the defective rate is high due to insufficient cleaning of the wafer is prevented.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning, in particular to a chain lifting device for cleaning and drying chain wafers. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. [0003] The existing wafer needs to be cleaned and dried after production. In the existing technology, the automatic cleaning and drying of the wafer is usually to pass the wafer through the cleaning tank, and then use the drying device to blow out hot air for drying. However, the current Some wafers have poor cleaning and drying effects, often resulting in excessive residual stains and incomplete drying on the wafer...

AI Technical Summary

Problems solved by technology

[0003] The existing wafer needs to be cleaned and dried after production. In the existing technology, the automatic cleaning and drying of the wafer is usually to pass the wafer through the cleaning tank, and then use the drying device to blow out hot air for drying. However, the current Some wafers have poor cleaning and drying effects, often resulting in excessive residual stains and incomplete drying on the wafers, and there are certain defects

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