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Scanning electroforming device and method for alternately implementing flushing-electrodeposition in different planes

An electrodeposition and electroforming technology, applied in electroforming and electrolysis processes, etc., can solve the problems of increased thickness of mesh parts, limited ability of liquid flow state, high scouring speed, etc., so as to suppress electrodeposition and reduce the degree of shrinkage. , the effect of rapid and symmetrical thickening

Active Publication Date: 2022-02-18
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this method is used for electroforming, in order to avoid the large-area metal anode arranged on the right side of the cathode base from interfering with the flow of the electroforming solution, it is necessary to open a certain number of through holes on the large-area metal anode to reduce the large-area metal anode. Obstacles to the flow of the electroforming solution, or replace the large-area metal anode with an "anode wall" made up of a large number of small anodes stacked, the electroforming solution can flow through the gaps between the small anodes to form a relatively stable These two operations will not only destroy the integrity of the metal anode but also have limited ability to improve the flow state of the liquid. Moreover, when this electroforming method is used, the mesh can only be thickened on one side, and the electroformed The thickness growth of mesh parts is limited, and at the same time, it will cause the asymmetry of the mesh parts obtained by electroforming. If a large-area open anode is arranged on both sides of the mesh part to realize double-sided electroforming, the cost will be too high
In addition, when this electroforming solution is adopted, it is extremely difficult for the electroforming solution to form a high scouring velocity in the mesh of the mesh, and it is difficult to ensure that the flow field state on the surface of the mesh is consistent, which leads to the It is difficult to achieve a uniform deposition rate everywhere on the surface
[0005] At the same time, the three characteristics of large thickness, high opening rate, and two-way horn holes are the main signs of high-performance electroformed mesh parts, but the existing electroforming methods and related equipment and devices are difficult to achieve such electroforming effects.
The main reason is: it is difficult to realize the electroforming method and its implementation device of high-speed and uniform flushing of the mesh without disturbing the electric field distribution at the same time

Method used

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  • Scanning electroforming device and method for alternately implementing flushing-electrodeposition in different planes
  • Scanning electroforming device and method for alternately implementing flushing-electrodeposition in different planes
  • Scanning electroforming device and method for alternately implementing flushing-electrodeposition in different planes

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Embodiment Construction

[0030] The implementation of the present invention will be further described below in conjunction with the accompanying drawings.

[0031] Such as figure 1 , figure 2 with image 3As shown in the figure, a scanning electroforming device is alternately implemented for flushing and electrodeposition on different surfaces, including an electroforming tank 1, a motor 9, a fixture 12, an electroforming liquid circulation filter unit 2 and a power supply unit 3, and is characterized in that it It also includes the right spray liquid-anode combination unit 5 and the left spray liquid-anode combination unit 4; the clamp 12 includes a clamp body 12-1 and a clamp cover plate 12-2; between the clamp body 12-1 and the clamp cover plate 12-2 It is used to install and fix the primary electroforming mesh part 7; the fixture 12 is detachably installed in the fixture holder 1-1 in the middle of the electroforming tank 1; the electroforming liquid circulation filter unit 2 also includes a ci...

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Abstract

The invention relates to the technical field of electroforming, and provides a scanning electroforming device and method for alternately implementing flushing-electrodeposition on different planes. According to the device, an electroforming tank, an electroforming liquid circulating filtering unit and a power supply unit serve as the basis, a left liquid spraying-anode combination unit and a right liquid spraying-anode combination unit serve as the core, and the purpose of manufacturing a mesh part with a high aperture ratio through electroforming by alternately implementing liquid flushing-electrodeposition on different planes is jointly achieved. On the basis of utilizing an electroforming additive, a left narrow slit spray head and a right narrow slit spray head which are controlled by an electroforming liquid loop change-over valve and a left anode and a right anode which are controlled by a loop change-over switch are creatively adopted to carry out electroforming processing on the primary electroforming mesh part. The left narrow slit spray head and the right anode work synchronously, the right narrow slit spray head and the left anode work synchronously, the two sides of the mesh part are subjected to alternate scanning, liquid flushing and electroforming, and the purpose that the two sides of meshes of the mesh part are thickened together is achieved. The device is easy to operate, and the mesh part with large thickness, high aperture ratio and bidirectional symmetrical horn-shaped meshes can be simply and efficiently electroformed and manufactured.

Description

technical field [0001] The patent of the present invention relates to the technical field of electroforming, and specifically relates to a scanning electroforming device and method for alternately implementing flushing and electrodeposition on different surfaces. Background technique [0002] Electroforming is a special processing technology that realizes precision manufacturing of metal-based parts in an electroforming tank based on the principle of electrochemical cathodic deposition. Electroforming can be used to manufacture mesh parts with microporous structures. For example, in the printing nickel screen which plays a key role in the printing and dyeing industry, dyes can pass through the predetermined holes on the nickel screen to form patterns. In order to make the printed nickel mesh have good mechanical properties and not easy to be broken and damaged during use, the nickel mesh needs to have a certain thickness. At the same time, in order to obtain delicate and del...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/08
CPCC25D1/08
Inventor 明平美张亚赛闫亮牛屾李伦旭李宗彬王伟郑兴帅
Owner HENAN POLYTECHNIC UNIV