Unlock instant, AI-driven research and patent intelligence for your innovation.

Clamp for panel-level electroplating

A panel and fixture technology, applied in circuits, electrolytic components, electrolytic processes, etc., can solve problems such as low electroplating efficiency and uneven thickness of the coating

Pending Publication Date: 2022-02-18
SIPLP MICROELECTRONICS CHONGQING CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many technical barriers to panel-level electroplating, such as: 1. The existing fixtures for panel-level electroplating require manual loading and dismounting of the carrier board; When the head is immersed in the plating solution during electroplating, a plating layer will be formed on it, and the plating layer of the chuck needs to be removed; 4. The front and back sides of the carrier board will be immersed in the plating solution, and the non-plating surface needs to be cleaned, resulting in low plating efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Clamp for panel-level electroplating
  • Clamp for panel-level electroplating
  • Clamp for panel-level electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0057] figure 1 It is a three-dimensional structure diagram of the fixture for panel-level electroplating according to the first embodiment of the present invention. figure 2 Yes figure 1 Schematic diagram of the exploded structure of the fixture used for panel-level plating in . image 3 and Figure 4 Respectively, the first clamping strip and the second clamping strip are in different states, along the figure 1 Sectional view of line AA in .

[0058] refer to Figure 1 to Figure 4 As shown, the panel-level electroplating fixture 1 of the present embodiment includes:

[0059] The fixture seat 11 includes a frame 110, and the frame 110 includes opposite first sides 110a and second sides 110b;

[0060] The first clip bar 12 includes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a clamp for panel-level electroplating. The clamp comprises a clamp seat, a first clamping strip, a second clamping strip, a first elastic component and a second elastic component. The clamp seat comprises a frame, and the frame comprises a first side and a second side which are opposite to each other; the first clamping strip comprises a first plate part and a second plate part which are connected with each other, and the second plate part is suitable for being driven by rotation of the first plate part to be away from the first side of the frame; the second clamping strip comprises a third plate part and a fourth plate part which are connected with each other, and the fourth plate part is suitable for being driven by rotation of the third plate part to be away from the second side of the frame; the first elastic component and the second elastic component both comprise free ends, and the free end of the first elastic component is suitable for abutting against the first plate part so as to drive the second plate part to abut against the first side of the frame; the free end of the second elastic component is suitable for abutting against the third plate part so as to drive the fourth plate part to abut against the second side of the frame. According to the clamp for panel-level electroplating, the loading and unloading automation of a to-be-electroplated carrier plate can be realized, and the non-electroplated surface is prevented from being cleaned.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a fixture for panel-level electroplating. Background technique [0002] Panel-level packaging (panel-level package) is about cutting the wafer to separate multiple dies, arranging and pasting multiple dies on the carrier board, and packaging each die at the same time in the same process flow. As a rising technology in recent years, panel-level packaging has attracted extensive attention. Compared with traditional wafer-level packaging (wafer-level package), panel-level packaging has the advantages of high production efficiency, low production cost, and suitable for mass production. [0003] Panel-level packaging generally requires electroplating to form rewiring layers and pins. However, there are many technical barriers to panel-level electroplating, such as: 1. The existing fixtures for panel-level electroplating require manual loading and disassembly of the carrier boa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D7/12C25D17/06
CPCC25D7/12C25D17/06
Inventor 吴太林谢政吉
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD