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Binding device and binding method in micro-component manufacturing process and welding agent containing unit

A soldering agent and micro-component technology, applied in welding equipment, electrical components, laser welding equipment, etc., to achieve cost saving, fast binding, and reduce line damage

Inactive Publication Date: 2022-02-18
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art, the purpose of this application is to provide a binding device, a binding method and a solder holding unit in the micro-component manufacturing process, aiming at solving the problem of the connection between the component electrode and the backplane electrode after the component electrode is peeled off from the substrate. Technical issues with binding

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  • Binding device and binding method in micro-component manufacturing process and welding agent containing unit
  • Binding device and binding method in micro-component manufacturing process and welding agent containing unit
  • Binding device and binding method in micro-component manufacturing process and welding agent containing unit

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Embodiment Construction

[0053] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0055] For micro-components, such as Micro LED or other types of micro-components...

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Abstract

The invention relates to a binding device and a binding method in a micro-component manufacturing process and a welding agent containing unit. The method comprises the following steps: stripping a to-be-bound micro-component from a substrate; picking up and transferring the to-be-bound micro-component to a welding agent containing unit through a transferring mechanism, so as to enable the component electrode of the to-be-bound micro-component to adhere a molten welding agent from a welding agent hole of the welding agent containing unit; and transferring the to-be-bound micro-component adhered with the molten welding agent to a driving back plate, and binding the to-be-bound micro-component and the driving back plate after the welding agent is cooled. Therefore, rapid binding of the to-be-bound micro-component and the driving backboard is realized, the problem of circuit damage of the to-be-bound micro-component and the driving backboard caused by existing laser welding is reduced, and the cost is saved.

Description

technical field [0001] The present application relates to the field of display technology, and in particular to a binding device, a binding method and a solder holding unit for binding micro components and driving backplanes in the micro component manufacturing process. Background technique [0002] Micro-components, taking Micro Light-Emitting Diode (Micro LED) as an example, in the mass transfer process, the binding of the component electrodes and the backplane electrodes after the micro-components to be bonded are peeled off from the substrate has always been an industry standard. One of the difficulties in the current technology is to put solid indium or tin on the backplane electrode, and then put the component electrode to be bound to the micro-component, and then bind it through the laser welding process. However, this bonding method is likely to cause the problem of damage to the micro-components to be bonded and the circuit on the driving backplane. Moreover, due to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L21/683B23K26/21B23K26/70
CPCH01L33/62H01L21/6835B23K26/702B23K26/21H01L2933/0066H01L2221/68372
Inventor 范春林许时渊王斌汪庆
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD