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A method of forming a device structure

A device structure and bonding material technology, applied to needle point/slotted plate contacts used to penetrate insulating wires/cable core wires, other household appliances, flat products, etc., can solve problems such as increased material costs

Pending Publication Date: 2022-02-18
NEWSOUTH INNOVATIONS PTY LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This factor leads to an increase in material cost, which can be considerable if an expensive metal such as indium must be used to achieve a reliable bond to the metal fingers on the solar cell

Method used

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  • A method of forming a device structure
  • A method of forming a device structure
  • A method of forming a device structure

Examples

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Embodiment Construction

[0094] Accordingly, embodiments of the present invention generally relate to structured connectors, i.e., connectors having a non-circular cross-sectional shape, for positioning on and electrically coupling to a surface of a device component, such as a solar cell, whereby the structure UL connectors also allow connection of device components such as solar cells within a device structure such as a photovoltaic module.

[0095] Furthermore, an embodiment of a method for forming a device structure will be described which allows interconnection of device components within a device structure by means of a structured connector provided according to an embodiment of the present invention.

[0096] In the following description, embodiments of the structured connector will be described in particular with respect to a solar cell structured connector for interconnecting solar cells within a photovoltaic module. Embodiments of structured connectors related to methods of forming photovolta...

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Abstract

A method of forming a device structure comprising: providing a device component having front and rear surfaces and having at least one electrically conductive region on at least one of the surfaces; providing a contact sheet comprising a polymeric material and at least one electrically conductive element that has a non-circular cross-sectional shape embedded in the polymeric material in a manner such that a surface portion is exposed; applying a bonding material to either one or both of the exposed surface portion and at least one of the electrically conductive regions; positioning the contact sheet relative to the device component such that the bonding material is located between the at least one electrically conductive region and the exposed surface portion; and activating the bonding material such that a bond and an electrically conductive coupling is formed between the at least one electrically conductive region and the exposed surface portion.

Description

technical field [0001] The present invention relates to a method of forming a device structure. Background technique [0002] Most solar modules used to convert sunlight into electricity include silicon-based solar cell arrays. Individual solar cells are typically fabricated using doped crystalline silicon wafers and include electron and hole collection regions. These carrier collection regions can be formed by solid-state diffusion or by applying a surface layer that selectively collects one polarity of carriers when the solar cell is illuminated. To extract photogenerated charge carriers from a solar cell, a conductive region comprising a metal electrode (or contact) is typically formed in contact with the cell's electron and hole contact regions. Wires can then be bonded or connected to these metal electrodes, enabling individual solar cells to be connected into an array of solar cells configured in a series or parallel electrical arrangement. The cells thus laid out a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/00H01L23/488H01L31/0224H01L31/05H01R4/02H01R4/04H01R4/24H01R43/02B29K705/00B29L7/00
CPCH01L31/02008H01L31/022433H01L31/0508H01L31/048H01L31/0512H01L31/0481H01L31/0547
Inventor 艾莉森·琼·列侬宋宁李扬萧佩杰欧阳子查尔斯·阿拉姆·曼德拉·霍尔卡罗琳·罗默王知萌
Owner NEWSOUTH INNOVATIONS PTY LTD