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Wave-soldering carrier dismounting and reflowing device and method

A reflow device and wave soldering technology, applied in auxiliary devices, welding equipment, manufacturing tools, etc., can solve the problems of low degree of automation and high labor intensity, and achieve the effect of high degree of automation, improved separation efficiency, and improved removal efficiency.

Pending Publication Date: 2022-02-25
GREE ELECTRIC APPLIANCES CHONGQING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The wave soldering carrier includes the tooling and the PCB board embedded in the tooling. After the wave soldering is completed, the tooling and PCB board need to be disassembled and separated from the wave soldering carrier. At present, the disassembly and separation work requires manual work, which is labor-intensive and low degree of automation

Method used

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  • Wave-soldering carrier dismounting and reflowing device and method
  • Wave-soldering carrier dismounting and reflowing device and method
  • Wave-soldering carrier dismounting and reflowing device and method

Examples

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Effect test

Embodiment 1

[0041] Please refer to the attached Figure 1-6 , a wave soldering carrier removal and reflow device, including a release mechanism 1, a separation mechanism 2, a clamping mechanism 4, a PCB board transport mechanism 3 and a tooling reflow mechanism 5; the output end of the release mechanism 1 is connected to the input end of the separation mechanism 2 , the clamping mechanism 4 is located on one side of the separation mechanism 2, and is used to clamp the PCB board and the tooling in the separation mechanism 2 to the PCB board transport mechanism 3 and the tooling return mechanism 5 respectively.

[0042] In this embodiment, the wave soldering carrier 19 includes a tooling and a PCB board embedded in the tooling. The front end of the tooling includes a folded pressing plate 51. When the pressing plate 51 is turned over to the top of the PCB, the PCB is fastened and positioned; the pressing plate 51 is turned over to the PCB. When the board is on the plane, the PCB board will ...

Embodiment 2

[0058] A method for disassembling and reflowing a wave soldering carrier 19 includes the device structure in Embodiment 1, and includes a control center of the overall device. In the embodiment, the signals of each mechanism are transmitted to the control center and uniformly deployed through the control center. Specifically include the following steps:

[0059] S01: The wave soldering carrier 19 enters the release mechanism 1, and the turning unit turns the pressure plate to the plane where the PCB board is located; the moving plate 14 in the toggle unit drives the lever 15 to reciprocate, so that the buckle 21 on the tooling is unscrewed, at this time The wave soldering carrier 19 is in a released state.

[0060] Step S01 specifically includes:

[0061] S011: The first photoelectric detector 7 detects that the wave soldering carrier 19 enters the release mechanism 1, and the control center controls the first blocking cylinder 11 to extend; the control center controls the fi...

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Abstract

The invention discloses a wave-soldering carrier dismounting and reflowing device which comprises a releasing mechanism, a separating mechanism, a clamping mechanism, a PCB conveying mechanism and a tool reflowing mechanism. The output end of the releasing mechanism is connected to the input end of the separating mechanism, and the clamping mechanism is located on one side of the separating mechanism. The releasing mechanism comprises an overturning unit and a shifting unit, the overturning unit overturns the pressing plate, the shifting unit comprises a moving plate and shifting rods located on the two sides of the moving plate, and the moving plate is arranged above the wave-soldering carrier and can reciprocate in the direction perpendicular to the transmission direction of the wave-soldering carrier; and the bottom of the shifting rod is tangent to the buckle. According to the wave-soldering carrier dismounting and reflowing device and method, the PCB and the tool in the wave-soldering carrier can be automatically released, the PCB and the tool are automatically separated through the clamping mechanism, and the separation efficiency of the wave-soldering carrier is greatly improved.

Description

technical field [0001] The invention belongs to the field of wave soldering blanking, in particular to a device and method for disassembling and reflowing a wave soldering carrier. Background technique [0002] In the production process of the inverter air conditioner controller, the power module needs to be welded on the opposite side of the welding surface and installed in the air. It has strict requirements on the welding height. In the production, selective wave soldering is usually used for welding, and the welding integrated tooling is used as the wave soldering load during the welding process. To ensure the accuracy of welding position and height. [0003] The wave soldering carrier includes the tooling and the PCB board embedded in the tooling. After the wave soldering is completed, the tooling and PCB board need to be disassembled and separated from the wave soldering carrier. At present, the disassembly and separation work requires manual work, which is labor-inten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K1/08
CPCB23K3/08B23K1/085
Inventor 粟龙阙昌力徐杰向媚田润王君
Owner GREE ELECTRIC APPLIANCES CHONGQING
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