Double-layer C6v lattice metamaterial sensor based on three-dimensional metal printing technology

Abstract

The invention discloses a double-layer C6v lattice metamaterial sensor based on a three-dimensional metal printing technology, which comprises a first periodic lattice structure, a first substrate, a second periodic lattice structure, a second substrate and a third periodic lattice structure which are integrally formed by three-dimensional metal printing. The second periodic lattice structure is arranged between the lower surface of the first substrate and the upper surface of the second substrate; the first periodic lattice structure is arranged on the upper surface of the first substrate, and the third periodic lattice structure is arranged on the lower surface of the second substrate. In the design process, rich physical effects in condensed physics are ingeniously combined with the traditional acoustic waveguide structure design. In condensed state physics, due to structural periodicity and Bragg scattering, energy is in strip distribution in a reciprocal lattice vector space, so that propagation of the energy can be effectively regulated and controlled, and the signal fidelity and the signal-to-noise ratio of a traditional acoustic device are improved.

Description

technical field [0001] The invention belongs to the field of continuum metamaterials with periodic changes in elastic modulus, in particular to a double-layer C6v lattice metamaterial sensor based on three-dimensional metal printing technology. Background technique [0002] In traditional acoustic integrated devices, improving the signal fidelity and signal-to-noise ratio of the system has always been the focus of researchers. However, due to the machining accuracy error and the interference of environmental noise, most of the acoustic signal is scattered by the defects of the acoustic device, and the environmental noise will also cover the target signal to be measured. Therefore, signal distortion and low signal-to-noise ratio have always been problems that acoustic integrated devices need to solve, and the robustness to overcome environmental noise has great limitations in improving the performance of traditional acoustic devices. At the beginning of the 21st century, sci...

AI Technical Summary

Problems solved by technology

However, due to machining accuracy errors and interference from environmental noise, most of the acoustic signal is scattered by the defects of the acoustic device, and the environmental noise will also cover the target signal to be measured

Therefore, signal distortion and low signal-to-noise ratio have always been the problems that acoustic integrated devices need to solve, and the robustness to overcome environmental noise has great limitations in improving the performance of traditional acoustic devices.

Images