Through hole detection method and device, computer equipment and readable storage medium

Abstract

The embodiment of the invention provides a through hole detection method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring all actual design parameters of a plurality of through holes in a PCB to be detected, performing specification detection on the plurality of through holes according to all the actual design parameters of the plurality of through holes, and prompting an abnormal through hole when the abnormal through hole of which the actual design parameter does not meet the specification requirement exists in the plurality of through holes; further, determining the abnormal through hole to be rechecked, and presenting the actual design parameters of the abnormal through hole to be rechecked for subsequent rechecking. According to the through hole detection method, automatic detection of the specifications of the through holes in the to-be-detected PCB is realized, the detection efficiency is improved and the specifications are detected according to all the actual design parameters of the plurality of through holes in the to-be-detected PCB. In addition, the detection comprehensiveness of the through holes is also improved, and the detection accuracy is further improved.

Description

technical field [0001] The present application relates to the field of computer technology, in particular to a through hole detection method, device, computer equipment and readable storage medium. Background technique [0002] The design and development of a printed circuit board (PCB) is a very complicated process. During the design process, various design requirements must be taken into account, and the heat dissipation problem of through holes on the PCB is closely related to the performance of the PCB. Therefore, for The design requirements of through holes on the PCB need to be focused. [0003] In the traditional technology, by obtaining the number of core board layers connected to each through hole on the PCB, it is judged whether the obtained number of core board connection layers is greater than the maximum allowable number of connection layers, and if so, it indicates that the core board connected to the corresponding through hole The number of layers exceeds the...

AI Technical Summary

Problems solved by technology

[0003] In the traditional technology, by obtaining the number of core board layers connected to each through hole on the PCB, it is judged whether the obtained number of core board connection layers is greater than the maximum allowable number of connection layers, and if so, it indicates that the core board connected to the corresponding through hole The number of layers exceeds the standard, resulting in excessive heat dissipation during subsequent soldering on the through hole, resulting in poor soldering, such as virtual soldering

[0004] It can be seen that the detection of through holes on the PCB in the traditional technology is only limited to the number of connection layers, and the detection content is single, which leads to low detection accuracy

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