High-linearity modulator chip based on cascaded silicon-based micro-ring modulator and modulation method

A micro-ring modulator and modulator technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of increasing the complexity and cost of chip processing, and achieve the effect of reducing size and power consumption, and saving production costs

Pending Publication Date: 2022-03-04
ZHEJIANG LAB
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method changes the process flow of the chip ...

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  • High-linearity modulator chip based on cascaded silicon-based micro-ring modulator and modulation method
  • High-linearity modulator chip based on cascaded silicon-based micro-ring modulator and modulation method
  • High-linearity modulator chip based on cascaded silicon-based micro-ring modulator and modulation method

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0031] Such as figure 1 As shown, the high linearity modulator chip based on the cascaded silicon-based microring modulator includes: two input couplers for coupling the optical carrier signal output by the laser into the modulator chip, one for coupling the two input The optical signal of the end coupler is synthesized into a beam combiner, a bus waveguide connected to the beam combiner for transmitting optical signals, two cascaded silicon-based microring modulators (Si-MRM1), and a bus waveguide connected to the bus waveguide The output coupler;

[0032] The two cascaded silicon-based microring modulators include a first silicon-based microring modulator and a second silicon-based microring modulator, the two silicon-based microring modulators are completely identical, and are coupled on the same bus waveguide. "1" in the figure is the coupler betwee...

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Abstract

The invention discloses a high-linearity modulator chip based on a cascaded silicon-based micro-ring modulator and a modulation method. The two lasers with different wavelengths output optical carrier signals, the optical carrier signals are combined through the on-chip beam combiner or the wavelength division multiplexer, and due to the fact that the micro-ring modulators have the wavelength selection function, two paths of optical carriers are respectively coupled into the two silicon-based micro-ring modulators through the bus waveguides. An electric modulation signal is divided into two paths through an electric power divider with an adjustable power division ratio, and the two micro-ring modulators are modulated respectively. By regulating and controlling the working points of the two micro-ring modulators, one micro-ring modulator works at a first-order harmonic component maximum point, and the other micro-ring modulator works at a third-order nonlinear maximum point. Meanwhile, the distribution ratio of the electric power divider is regulated and controlled, and during demodulation at the photoelectric detector end, through the operation, the third-order nonlinearity in the two micro-rings can be offset, and meanwhile it is guaranteed that the first-order harmonic component changes little.

Description

technical field [0001] The invention relates to a high-linearity modulator chip based on a cascaded silicon-based microring modulator, in particular to a high-linearity modulator chip and a modulation method based on a cascaded silicon-based microring modulator. Background technique [0002] In recent years, microwave photon technology, which combines microwave technology and light wave technology, has been widely used in wireless communication, optical fiber radio frequency transmission system and radar electronic warfare. It mainly studies how to use optoelectronic devices and optical methods to realize the generation, transmission, processing and detection of microwave / millimeter wave signals. With the increasing functional complexity of microwave photonic systems and the urgent need for cost reduction, it is required to reduce the size, weight and power consumption from the device to the system, so as to realize the miniaturization, light weight and low cost of the syste...

Claims

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Application Information

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IPC IPC(8): G02F1/01
CPCG02F1/0113G02F1/0102G02F1/0121Y02D30/70
Inventor 张强余辉
Owner ZHEJIANG LAB
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