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Electronic device and method for controlling data throughput based on heat generation in electronic device

An electronic device and throughput technology, applied in the direction of using electric devices, electric digital data processing, and thermometers using electric/magnetic elements that are directly sensitive to heat, can solve problems such as not being made, and achieve heat reduction and stability The effect of application execution

Pending Publication Date: 2022-03-04
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

No determination has been made, and no assertion is made, as to whether any of the foregoing would be applicable as prior art with respect to the present disclosure

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  • Electronic device and method for controlling data throughput based on heat generation in electronic device
  • Electronic device and method for controlling data throughput based on heat generation in electronic device
  • Electronic device and method for controlling data throughput based on heat generation in electronic device

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Embodiment Construction

[0034] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid in that understanding but these should be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following descr...

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Abstract

Various embodiments related to an electronic device are described. According to an embodiment, an electronic device may include a display, an input unit configured to include at least one biometric sensor, at least one processor, and a memory configured to include instructions. The instructions may be configured, when executed, to cause the at least one processor to: perform user authentication according to biometric sensing information obtained by the at least one biometric sensor in response to an input to the input unit; identifying whether the duration of the input exceeds a first threshold time; performing a first function when the duration is less than or equal to a first threshold time in response to success of the user authentication; and performing a second function when the duration exceeds a first threshold time in response to success of the user authentication.

Description

technical field [0001] The present disclosure relates to an electronic device. More particularly, the present disclosure relates to an electronic device and method for improving heat generation in an electronic device. Background technique [0002] Efforts have been made to develop a fifth generation (5G) communication system in order to meet the increasing demand for wireless data services since the commercialization of the fourth generation (4G) communication system. In order to achieve a high data transmission rate, attempts have been considered to make the 5G communication system use, for example, an ultra-high frequency band ( For example, the new frequency band of the 60GHz band). [0003] A plurality of antenna modules may be installed in an electronic device to support millimeter wave (mmWave) which is an ultra high frequency band. Wireless channels in mmWave bands have high straightness and high path loss due to their high-frequency characteristics. In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F9/48G06F9/50G01K1/02
CPCG06F1/206G06F9/4893G06F9/5094G01K1/026Y02D10/00G06F1/1698G06F1/3215G06F1/329G06F1/3243G01K13/00G01K7/22
Inventor 卢泫陈方性龙李钟麟金钟佑金学烈金武永
Owner SAMSUNG ELECTRONICS CO LTD
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