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LED packaging adhesive film, application of LED packaging adhesive film and LED packaging structure

A technology of LED encapsulation and encapsulation film, which is applied in the direction of film/sheet adhesives, adhesives, films/sheets without carriers, etc. The effect of junction stability

Pending Publication Date: 2022-03-08
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a kind of LED encapsulating adhesive film, the application of LED encapsulating adhesive film and LED encapsulating structure, in order to solve the problem of difficult repair of LED encapsulating device in the prior art

Method used

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  • LED packaging adhesive film, application of LED packaging adhesive film and LED packaging structure
  • LED packaging adhesive film, application of LED packaging adhesive film and LED packaging structure
  • LED packaging adhesive film, application of LED packaging adhesive film and LED packaging structure

Examples

Experimental program
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Effect test

Embodiment 1

[0048] The LED packaging adhesive film double-layer film of Example 1 includes a first adhesive film layer and a second adhesive film layer. The first adhesive film layer is a silane-modified ethylene-butene copolymer (Dow Chemical) with a melting index of 8 g / 10min and a thickness of 200 μm. The second adhesive film layer is a PET film (DuPont) with a thickness of 10 μm.

Embodiment 2

[0050] The LED packaging adhesive film double-layer film of Example 2 includes a first adhesive film layer and a second adhesive film layer. The first adhesive film layer comprises 90wt% of silane-modified ethylene-butene copolymer with a melt index of 5g / 10min and 10wt% of an ethylene-vinyl acetate copolymer with a melt index of 30g / 10min, and has a thickness of 50 μm. The second adhesive film layer is a PET film (DuPont) with a thickness of 50 μm.

Embodiment 3

[0052] The LED packaging adhesive film double-layer film of Example 3 includes a first adhesive film layer and a second adhesive film layer. Wherein the first adhesive film layer comprises 50wt% of a silane-modified ethylene-butene copolymer (Dow Chemical) with a melt index of 30g / 10min and 50wt% of an ethylene-vinyl acetate copolymer with a melt index of 15g / 10min, The thickness is 200 μm. The second adhesive film layer is a PET film (DuPont) with a thickness of 300 μm and a random embossing of 10 μm deep on the surface.

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Abstract

The invention provides an LED packaging adhesive film, application of the LED packaging adhesive film and an LED packaging structure. Raw materials for forming the LED packaging adhesive film comprise matrix resin, the matrix resin comprises tackifier modified matrix resin, the melt index of the structure, used for being close to one side of the LED optical unit, of the LED packaging adhesive film is 5-45 g / 10 min, the bonding force of the LED packaging adhesive film and the LED optical unit is larger than 30 N / cm, and the light transmittance of the LED packaging adhesive film is larger than 80%. According to the LED packaging adhesive film, the melt index of matrix resin of a structure close to one side of an LED optical unit is 5-45 g / 10 min, an LED packaging device is heated during repair, the LED packaging adhesive film has high fluidity based on the low melt index, and separation of the LED packaging adhesive film is facilitated; and the bonding force between the LED packaging adhesive film and the LED optical unit is greater than 30N / cm, so that the bonding stability of the LED packaging adhesive film is ensured.

Description

technical field [0001] The invention relates to the field of LED display, in particular, to an LED packaging adhesive film, an application of the LED packaging adhesive film and an LED packaging structure. Background technique [0002] The LED display device is a display screen formed by splicing LED unit boards. The structure of the LED unit board is that different sizes, different spacings, and different numbers of LED optical units are distributed on the circuit board. In some outdoor fields, there is often a layer of potting glue to enhance the waterproof performance. LED unit boards can be seamlessly connected without splicing obstacles. Different collocations can be used according to the needs of use, and the display screens of different sizes are spliced. At the same time, the LED display screen can control the brightness and color of the lamp beads through the chip according to different lighting conditions, such as indoor and outdoor, sunny and back, and has good ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/30C09J123/26H01L25/075H01L33/56
CPCC09J7/10C09J7/30C09J123/26H01L33/56H01L25/0753C09J2301/208C09J2203/326
Inventor 王龙毛云飞侯宏兵周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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