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Seamless splicing screen

A seamless splicing and inorganic technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as the inability to realize seamless splicing screens, large seams, etc., and achieve the effect of reducing seams and improving alignment accuracy

Pending Publication Date: 2022-03-11
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the alignment mark of the sub-board is usually placed outside the display area and within the cutting line, so when the sub-board is aligned, due to the existence of the alignment mark, it will inevitably lead to a large seam between two adjacent sub-boards. Unable to achieve seamless splicing screen technology

Method used

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0030] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...

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Abstract

The invention discloses a seamless splicing screen. The seamless splicing screen comprises a mother board and a plurality of daughter boards arranged on the mother board in a splicing mode. Each daughter board comprises a plurality of pixel units distributed in multiple rows and multiple columns and at least one first alignment mark arranged at intervals with the pixel units; a gap region is formed between any two adjacent rows of pixel units or two columns of pixel units; the at least one first alignment mark is located in the gap area; the mother board comprises at least one second alignment mark arranged in one-to-one correspondence with the at least one first alignment mark of each daughter board; the projection of the first alignment mark in the direction perpendicular to the mother board coincides with or is embedded with the projection of the corresponding second alignment mark in the direction perpendicular to the mother board. According to the method and the device, splicing seams can be reduced, a seamless splicing screen technology is realized, and the alignment precision can be effectively improved through the alignment mode of the first alignment mark and the second alignment mark.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a seamless splicing screen. Background technique [0002] With the development of display panel technology, large-size public displays and commercial displays are increasingly sought after by the public. Since the direct production of large-size display panels is limited by generation lines, currently large-size display panels are usually produced by splicing. Taking OLED (Organic Light-Emitting Diode, organic light-emitting diode) display panel as an example, due to the characteristics of devices such as LTPS (Low Temperature Poly-silicon, low-temperature polysilicon), it is difficult to produce a display larger than 20 inches under the existing technology. Products, so that to obtain a large-size OLED display, it needs to be realized by splicing. [0003] In the transparent splicing display technology, the splicing screen is formed by conducting conduction between ...

Claims

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Application Information

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IPC IPC(8): H01L23/544H01L27/32
CPCH01L23/544H10K59/12
Inventor 刘娜马蹄遥黄灿
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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