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Automatic cutting device

A technology for cutting devices and cutting parts, applied in chemical instruments and methods, non-rotational vibration suppression, solid separation, etc., can solve the problems of matrix soil falling, affecting the service life of cutting tools, and reducing the cutting efficiency of cutting devices, etc.

Pending Publication Date: 2022-03-15
NANJING COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the cutting device is in use, the matrix soil filled in the non-woven roll is easy to fall from it, and the scattered matrix soil will adhere to the surface of the cutting tool and the device, which reduces the cutting efficiency of the cutting device. , will also affect the service life of the cutting tool

Method used

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Examples

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0033] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention. ...

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Abstract

The invention discloses an automatic cutting device, and relates to the technical field of cutting equipment. The automatic cutting device comprises a feeding pipe, a clamping mechanism and a cutting mechanism which are sequentially arranged, wherein the clamping mechanism comprises a lower clamping plate, an upper clamping plate and a buffer cylinder located between the lower clamping plate and the upper clamping plate; the cutting mechanism comprises a fixed plate, an L-shaped plate and a cutting part, the cutting part comprises a feeding port, a power source and a movable tool bit, one plane of the L-shaped plate is perpendicularly connected to the fixed plate, the feeding port is formed in the plane, the movable tool bit which is connected with the power source and can move up and down is arranged above the feeding port, and the other plane of the L-shaped plate is parallel to the fixed plate. By arranging the clamping mechanism and the cutting mechanism, the non-woven fabric roll filled with matrix soil is cut, and the situation that the matrix soil in the non-woven fabric roll is scattered on the surface of the device during cutting, and the cutting efficiency of the cutting device and the service life of a cutter are affected is avoided.

Description

technical field [0001] The invention relates to an automatic cutting device, which belongs to the technical field of cutting machinery. Background technique [0002] The seedling raising method of cultivating crops or fruit trees, flowers and tree seedlings in specific containers. The containers are filled with nutrient-rich culture soil and other substrates. Seedlings are often raised in protective facilities such as plastic greenhouses and greenhouses, which can make the growth and development of seedlings better. Nutritional and environmental conditions, when making light-matrix non-woven fabric seedling containers, it is necessary to fill the matrix soil into the non-woven fabric roll, and then cut it by a cutting device. [0003] However, when the cutting device is in use, the matrix soil filled in the non-woven roll is easy to fall from it, and the scattered matrix soil will adhere to the surface of the cutting tool and the device, which reduces the cutting efficiency ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/06B26D7/00B26D7/01B26D7/02B26D7/08F16F15/04B07B1/28B07B1/46B07B1/50
CPCB26D1/06B26D7/01B26D7/02B26D7/086B26D7/00B07B1/28B07B1/46B07B1/50F16F15/04B26D2007/013
Inventor 钱胤嘉仇妍睿刘松林冯克善金晶
Owner NANJING COLLEGE OF INFORMATION TECH
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