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Semiconductor chip test seat

A chip testing, semiconductor technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of high production cost, Pogopin test PCB substrate can not be completely docked and used, high maintenance costs, etc., to achieve high service life of consumables, testing The effect of high stability and low cost of improvement

Pending Publication Date: 2022-03-15
苏州朗之睿电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, it is common to use a separate Pogo pin or a separate special-shaped test piece for testing, but in actual use, it is found that: 1. The disadvantages of a single Pogo pin test seat are short life, high maintenance costs, and downtime in the maintenance process affects output; 2. If the special-shaped test piece is used to replace the Pogo pin, due to the completely different structure and style, the original Pogo pin test PCB substrate cannot be completely docked and used. The original substrate is customized, and its production cost is high, so it is not suitable for enterprises. Application in actual production

Method used

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  • Semiconductor chip test seat
  • Semiconductor chip test seat
  • Semiconductor chip test seat

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Embodiment Construction

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0040] refer to figure 1 , a semiconductor chip test socket according to the embodiment of the present invention, including a substrate 1, an adapter module 2, an auxiliary adapter 3, a special-shaped test piece 4 and a chip limiter 5; the present invention adds an adapter module 2. Then use one end of the adapter module 2 to connect to the original expensive substrate 1 of the customer, and the other end to connect to the auxiliary adapter 3, and then connect the custom-made lower-priced auxiliary adapter 3 to the special-shaped test piece 4 as a whole , so as to realize the overall conduction connection between the special-shaped test piece 4 and the expensive substrate 1, which is convenient for performance testing of the chip 7 in the chip limiting member 5, and the improvement cost is low and the operation is convenient.

[0041...

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Abstract

The invention discloses a semiconductor chip test seat. The semiconductor chip test seat comprises a substrate; the switching module is arranged on the upper surface of the substrate; the auxiliary adapter is arranged on the upper surface of the adapter module; wherein the switching module is used for conducting the auxiliary switching piece and the substrate; the plurality of special-shaped test pieces are arranged on the auxiliary adapter through a limiting assembly; the chip limiting piece is arranged above the special-shaped test piece and is used for limiting the chip; wherein a pin of the special-shaped test piece is conducted with the auxiliary adapter plate, and a needle point of the special-shaped test piece is conducted with the chip located in the chip limiting piece. According to the semiconductor chip test seat, the adapter module is additionally arranged between the special-shaped test piece and the substrate, and the auxiliary adapter piece which is low in customization price is customized; the special-shaped test piece and the expensive substrate are conducted, the service life of consumables of the special-shaped test piece is long, the test stability efficiency is high, the overall improvement cost is low, the risk can be reduced, and the cost is saved.

Description

technical field [0001] The invention belongs to the technical field of electronic chip testing, in particular to a semiconductor chip testing seat. Background technique [0002] With the rapid development of modern electronic products, electronic chips are an important component core. In the process of production and processing, the inspection and control of quality is becoming more and more strict. [0003] Various performance tests are required in the large-scale research and development and production of semiconductor chips. The chip test socket plays a key role in the packaging and testing process. The function of the test socket is to position the chip and transmit the electronic signal current between the circuit boards to achieve inspection. Test the effect. [0004] At present, it is common to use a separate Pogo pin or a separate special-shaped test piece for testing, but in actual use, it is found that: 1. The disadvantages of a single Pogo pin test seat are short...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/28
CPCG01R1/0408G01R1/0416G01R31/2851G01R31/2884
Inventor 闵哲
Owner 苏州朗之睿电子科技有限公司