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Transfer device of LED chip and manufacturing method of display panel

A technology of LED chips and transfer devices, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of difficulty in the manufacturing process of Mini-LED/Micro-LED, so as to accelerate the efficiency of mass transfer, reduce costs, and improve The effect of productivity

Pending Publication Date: 2022-03-15
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0002] In recent years, due to its outstanding advantages and rapid development, Mini-LED / Micro-LED display technology has become a hotspot in the layout of major panel manufacturers. Compared with current LCD and OLED display devices, Mini-LED / Micro-LED has fast response , high color gamut, high resolution, low energy consumption, ultra-high number of partitions to achieve precise dimming, ultra-high contrast, etc. However, the manufacturing process of Mini-LED / Micro-LED is difficult, how to break through the mass transfer technology is the key to technological development The essential

Method used

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  • Transfer device of LED chip and manufacturing method of display panel
  • Transfer device of LED chip and manufacturing method of display panel
  • Transfer device of LED chip and manufacturing method of display panel

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention. In the present invention, unless stated to the contrary, the used orientation words such as "up" and "down" usually refer to up and down in the actual use or working state of the device, specifically the direction of the drawing in the drawings ; while "inside" and "outs...

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Abstract

The embodiment of the invention discloses a transfer device of an LED chip and a manufacturing method of a display panel. The LED chip transfer device comprises a device body and a plurality of pickup units located on the device body and used for picking up target LED chips, the pickup units have first opening sizes at a first temperature, the first opening sizes are larger than the overall dimensions of the target LED chips, the pickup units have second opening sizes at a second temperature, the second opening sizes are larger than the overall dimensions of the target LED chips, and the first opening sizes are larger than the overall dimensions of the target LED chips. The size of the second opening is smaller than or equal to the boundary dimension of the target LED chip, the size of the first opening is larger than the size of the second opening, and the first temperature is different from the second temperature; according to the transfer device for the LED chips, the sizes of the picking openings of the picking units of the transfer device for the LED chips are different at different temperatures, so that the picking and placing functions of the LED chips are achieved, the mass transfer efficiency of the LED chips is improved, the productivity is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the display field, in particular to an LED chip transfer device and a manufacturing method of a display panel. Background technique [0002] In recent years, due to its outstanding advantages and rapid development, Mini-LED / Micro-LED display technology has become a hotspot in the layout of major panel manufacturers. Compared with current LCD and OLED display devices, Mini-LED / Micro-LED has fast response , high color gamut, high resolution, low energy consumption, ultra-high number of partitions to achieve precise dimming, ultra-high contrast and other advantages. However, the manufacturing process of Mini-LED / Micro-LED is difficult. How to break through the mass transfer technology is the key to technological development. The essential. [0003] Therefore, there is an urgent need for an LED chip transfer device and a method for manufacturing a display panel to solve the above technical problems. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L33/00H01L33/62
CPCH01L27/156H01L33/62H01L33/0093
Inventor 周世新
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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