Automatic wafer mounting device
A technology for automatic installation and installation of devices, applied in assembly machines, metal processing equipment, metal processing and other directions, can solve the problems of crystal taking failure, low efficiency, etc., to improve the stability, avoid crystal taking failure, improve crystal solid accuracy and The effect of die bonding efficiency
Pending Publication Date: 2022-03-22
SHENZHEN XINYICHANG TECH CO LTD
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Problems solved by technology
[0003] The purpose of the embodiment of the present application is to provide an automatic wafer mounting device to solve the problem that the automatic wafer mounting device in the related art needs to suck the wafer on the wafer from the top, so that the wafer needs to be turned over before it can be supplied to the bond head, which is more efficient. Low, and due to the adsorption of the blue film, it is easy to lead to the failure of crystal extraction
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[0057] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0058] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0059] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specify...
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The invention provides an automatic wafer mounting device, and the device comprises a wafer supply unit which is used for supporting a wafer ring and supplying a wafer to a wafer supply position; the turret mechanism is used for transferring the wafer at the wafer supply position to the wafer taking position; the puncturing mechanism is used for downwards puncturing the blue film at the wafer on the wafer supply position so as to push the wafer to the turret mechanism; and the wafer fixing mechanism is used for sucking the wafer at the wafer taking position and moving the wafer to a wafer fixing position so as to mount the wafer on the substrate. According to the automatic wafer mounting device provided by the invention, the wafer supply unit is arranged to provide the wafer for the wafer supply position, and the puncture mechanism is arranged to puncture the blue film downwards so as to strip the wafer at the wafer supply position from the blue film, so that the turret mechanism can receive the wafer conveniently, and wafer taking failure can be avoided; the turret mechanism transfers the wafer from the wafer supply position to the wafer taking position, so that the wafer does not need to be overturned, the wafer moving stroke and time of the wafer fixing mechanism can be shortened, the wafer moving stability can be improved, and the wafer fixing precision and the wafer fixing efficiency can be improved.
Description
technical field [0001] The present application belongs to the technical field of crystal bonding, and more specifically relates to an automatic chip mounting device. Background technique [0002] When the crystal bonder is solidifying the crystal, it is necessary to take out the chip on the wafer installed in the crystal ring to fix it on the substrate. The chip has a front side and a back side. The back side of the chip is generally provided with electrodes to connect with the substrate, and the front side of the chip is attached to the blue film. In addition, since there are a large number of chips on the wafer, and these chips are attached to the blue film, and there are connecting parts between adjacent chips, it is necessary to separate the chips on the blue film for use in taking out the die-bonding. After the chip on the current wafer moves to the supply position, generally use the thimble mechanism to push the blue film upward to expand the blue film, and separate t...
Claims
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IPC IPC(8): B23P21/00B23P19/00
CPCB23P21/004B23P19/001B23P19/002
Inventor 黄岗曾国鹏严楚雄
Owner SHENZHEN XINYICHANG TECH CO LTD