Parallel-axis three-dimensional measurement method based on slice parallel single-pixel imaging
A three-dimensional measurement, single-pixel technology, used in measurement devices, instruments, optical devices, etc., to achieve the effects of high sensitivity, reduced number of projections, and high signal-to-noise ratio
Active Publication Date: 2022-03-22
BEIHANG UNIV
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[0004] In order to solve the problem of robust and high-precision three-dimensional measurement of self-occlusion objects such as deep holes, grooves, and steps, the present invention proposes a parallel-axis three-dimensional measurement method based on parallel single-pixel imaging of slices, and introduces parallel single-pixel imaging technology into vertical Scanning 3D measuring device
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[0039] In order to better understand the present invention, the technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0040] Refer to attached figure 1 , a parallel-axis three-dimensional measurement method based on slice-parallel single-pixel imaging, comprising the following steps:
[0041] 1. Before starting the measurement, refer to the attached figure 2 Adjust the position of the projector and the telecentric camera so that the optical axes and optical paths of the two are parallel. Among them, at most half of the image of the projector is projected onto the measured object through the half-transparent and half-reflecting prism.
[0042] 2. Calibrate depth reconstruction polynomial coefficients. For the specific calibration procedure, please refer to the attached image 3 , refer to the attached diagram for the schematic diagram of the calibration method Figure 4 . Before sta...
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The invention discloses a parallel-axis three-dimensional measurement method based on slice parallel single-pixel imaging, which is used for detecting vertical three-dimensional shapes such as deep holes, steps, grooves and the like on the surface of an object. The method is based on a projector optical axis triangle principle, optical axes of a projector and a telecentric camera are arranged in parallel, and depth reconstruction is carried out by utilizing the optical center distance of emergent light of the projector. The optical center distance observed by each camera pixel is determined by projection of an optical transmission coefficient resolved by slice parallel single-pixel imaging, by projecting and shooting transverse and longitudinal slice parallel single-pixel imaging substrate stripes, sub-pixel coordinates of a corresponding projector coordinate system are precisely positioned, and the optical center distance of the projector is calculated according to the optical center coordinates of the projector. During calibration, optical center distances under different depth planes are sampled, and depth mapping is fitted by using a third-order polynomial. During measurement, depth reconstruction is carried out according to the calibrated polynomial. According to the method, robust and high-precision vertical scanning three-dimensional measurement of self-shielding objects such as deep holes, grooves and steps is achieved, and meanwhile the method plays a good role in promoting three-dimensional measurement development of vertical scanning configuration.
Description
technical field [0001] The invention relates to a parallel-axis three-dimensional measurement method based on slice parallel single-pixel imaging, which extends the parallel single-pixel imaging technology to a vertical scanning three-dimensional measurement system, and improves the robustness, signal-to-noise ratio and precision of vertical scanning three-dimensional measurement. The invention belongs to the field of machine vision. Background technique [0002] Three-dimensional measurement has been widely used in manufacturing, entertainment, security, medical and other industries, among which fringe projection technology has become one of the most popular measurement methods due to its accuracy, speed, flexibility and multi-purpose. However, for objects with deep holes, grooves, and steps, traditional methods based on binocular stereo vision cannot fully measure these self-occlusion areas due to the excessive baseline distance. [0003] Vertical scanning devices can ove...
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IPC IPC(8): G01B11/25
CPCG01B11/254G01B11/2504
Inventor 赵慧洁王云帆姜宏志李旭东
Owner BEIHANG UNIV