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Circuit board assembly and electronic equipment

A circuit board assembly and circuit board technology, applied in the directions of printed circuit components, printed circuits, electrical components, etc., can solve the problems of poor heat dissipation effect, overheating, and limited heat dissipation capacity of heat dissipation components, so as to improve the heat dissipation effect and reduce stacking. The effect of thickness

Pending Publication Date: 2022-03-22
VIVO MOBILE COMM CO LTD
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AI Technical Summary

Problems solved by technology

Correspondingly, the power consumption required by circuit boards in electronic equipment is also increasing, which in turn leads to an increase in the heat generated by electronic equipment during operation
Due to the increased heat generation of electronic equipment, and the limited heat dissipation capacity of the heat dissipation components in electronic equipment, it may cause the electronic equipment to become hot during operation
It can be seen that the existing electronic equipment has the problem of poor heat dissipation

Method used

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  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0023] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," et...

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Abstract

The invention discloses a circuit board assembly and electronic equipment, and belongs to the technical field of electronic products. The circuit board assembly comprises a first rigid-flex board, the first rigid-flex board comprises a rigid board layer and a flexible board layer which are arranged in a stacked mode, the rigid board layer covers the surface of the flexible board layer, the flexible board layer comprises a flexible substrate and a heat conduction layer, the heat conduction layer covers the surface of the flexible substrate, and the heat conduction layer covers the surface of the flexible substrate; the first rigid-flex board is provided with a first electronic device, the heat conduction layer is provided with a heat dissipation area, and the heat dissipation area does not cover the rigid board layer; a first cavity is defined by the first circuit board and the first rigid-flex board, the heat dissipation area is located outside the first cavity, and the first electronic device is located in the first cavity.

Description

technical field [0001] The present application relates to the technical field of electronic products, in particular to a circuit board assembly and electronic equipment. Background technique [0002] With the continuous development of electronic equipment, the functions of electronic equipment are also constantly improved. Correspondingly, the power consumption required by the circuit boards in the electronic equipment is also increasing, which in turn leads to an increase in the heat generated by the electronic equipment during operation. Due to the increased heat generation of the electronic equipment and the limited heat dissipation capability of the heat dissipation components in the electronic equipment, it may cause the electronic equipment to become hot during operation. It can be seen that the existing electronic equipment has the problem of poor heat dissipation effect. Contents of the invention [0003] The application provides a circuit board assembly and elec...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/0203H05K1/144
Inventor 江志成
Owner VIVO MOBILE COMM CO LTD
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