Physical cutting method for magnetic base material
A magnetic base material and cutting method technology, which is applied in the direction of stone processing tools, stone processing equipment, inductance/transformer/magnet manufacturing, etc., can solve the problems of not being suitable for large-scale production, low product qualification rate, and large chipping size. Achieve the effect of improving cutting quality, reducing cost and reducing edge chipping size
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Embodiment 1
[0037] Based on a microwave ferrite substrate with a thickness of 0.4mm, adopt a cutting method, set different cutting parameters, measure the size of chipping on the front and back sides, and randomly measure 5 data as shown in Table 1. The cutting effect diagram is as follows figure 2 shown. When the tool is cutting, the spindle speed of the cutting machine is 28000 rpm, and the cutting depth is 0.42mm.
[0038] Table 1 The effect of different cutting speeds on the chipping of the front and back sides of the substrate
[0039]
Embodiment 2
[0041] Based on a microwave ferrite substrate with a thickness of 1.0mm, adopt a cutting method, set different cutting parameters, measure the size of chipping on the front and back sides, and randomly measure 5 data as shown in Table 2. The cutting effect diagram is as follows image 3 shown. When the tool is cutting, the spindle speed of the cutting machine is 30,000 rpm, and the cutting depth is 1.02mm.
[0042]Table 2 The effect of different cutting speeds on the chipping of the front and back sides of the substrate
[0043]
Embodiment 3
[0045] Based on a microwave ferrite substrate with a thickness of 1.5mm, adopt a one-time cutting method, set the cutting speed at 1.0mm / s, measure the edge chipping size of the front and back sides, and randomly measure 5 data as shown in Table 3. The cutting effect Figure such as Figure 4 shown. When the tool is cutting, the spindle speed of the cutting machine is 32000 rpm, and the cutting depth is 1.52mm.
[0046] Table 3 The effect of 1.0mm / s cutting speed on the edge chipping of the front and back of the substrate
[0047]
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