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Micromechanical structure and micromechanical sensor

A technology of micromechanical structure and detection mechanism, applied in the field of micromechanical sensor and micromechanical structure, can solve the problem of increasing sticking tendency

Pending Publication Date: 2022-03-25
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is further known that under frequent loading of the stop structure, the tendency to stick also increases

Method used

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  • Micromechanical structure and micromechanical sensor
  • Micromechanical structure and micromechanical sensor
  • Micromechanical structure and micromechanical sensor

Examples

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Embodiment Construction

[0034] figure 1 A micromechanical structure 1 is shown which has a substrate 2 and a seismic mass 3 which is movable relative to the substrate 2 . The torsion spring 5 connects the seismic mass 3 to the substrate 2, wherein, in figure 1Two torsion springs 5 ​​are shown in . A first direction 11 and a second direction 12 substantially perpendicular to the first direction 11 define a main plane of extension of the substrate 2 . The seismic mass 3 is rotationally deflectable about an axis of rotation 14 , wherein the axis of rotation 14 is arranged in the second direction 12 . For example, an acceleration acting in the third direction 13 can lead to this rotational deflection about the axis of rotation 14 because the seismic mass 3 is divided into a larger sub-mass 31 on the side of the torsion spring 5 and on the side of the torsion spring The smaller sub-mass 32 on the opposite side of 5 and this mass asymmetry lead to a corresponding offset. In principle, however, the inve...

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Abstract

The invention relates to a micromechanical structure having a substrate and a seismic mass which can be moved relative to the substrate, a torsion spring connecting the seismic mass to the substrate. The micromechanical structure further has a detection mechanism, a first direction and a second direction substantially perpendicular to the first direction defining a main extension plane of the substrate, the detection mechanism being provided for detecting a rotational offset of the seismic mass about the axis of rotation, the axis of rotation being arranged in the second direction. The micromechanical structure further comprises a stop structure, the stop structure being arranged in such a way that a movement of the seismic mass is limited by the stop structure, the stop structure being designed to absorb kinetic energy of the seismic mass during a partially elastic, partially inelastic impact.

Description

technical field [0001] The invention relates to a micromechanical structure and a micromechanical sensor. Background technique [0002] Acceleration sensors are generally formed from micromechanical structures (also called MEMS structures, micro-electromechanical system structures) which are etched out of thick polysilicon functional layers. It is disposed over a thin buried polysilicon layer. It is anchored to the substrate by means of an oxide layer. An oxide layer is also provided between the two polysilicon layers. Buried polysilicon layers are used as conductor lines or electrodes. Functional layers are eliminated by trench process and oxide sacrificial layer approach. The buried layer is electrically separated from the substrate by an oxide. Conductor lines and electrodes are wide enough not to be completely underetched during the oxide-sacrificial oxide etch step And thus stably anchored to the substrate. [0003] The micromechanical structures produced in thi...

Claims

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Application Information

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IPC IPC(8): B81B3/00B81B7/02G01P15/00
CPCB81B7/02B81B3/0021B81B3/0051G01P15/00B81B2201/0235B81B2203/058B81B3/0013B81B2203/0127G01P2015/0831G01P15/125G01P2015/0871G01P2015/0874
Inventor J·赖因穆特K-U·里曹
Owner ROBERT BOSCH GMBH
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