Method for preparing thick film substrate resistive layer by using automatic printing table according to initial resistance value

Abstract

The invention relates to a method for preparing a thick film substrate resistive layer by using an automatic printing table according to an initial resistance value, which comprises the following steps: selecting slurry according to the resistance value of each group of resistors, designing the theoretical length and width of a standard square resistor with the square number of 1 according to the standard resistance value of the slurry, and adjusting the printing speed to enable the initial resistance value to meet the design requirement; designing other pre-designed resistors according to the standard square resistor; the area of the pre-designed resistor and the area of the standard square resistor are compared, the length and the width of the resistor are designed according to the area and the theoretical value, the theoretical resistance value R = nR-= L / W * R-, or the theoretical resistance value is reduced / increased by 20%-30% according to the ratio of the theoretical design length to the theoretical design width of the pre-designed resistor. The method has the advantages that the process is simple, the automation degree is high, a large number of repeated periodic trial burning is not needed, the design requirement is met, the same-time printing can be achieved by well matching with the printing condition, and the method is particularly suitable for complex thick film integrated circuit substrates with multiple resistors and large area difference.

Description

technical field [0001] The invention relates to the production of resistance layers in the production stage of thick-film integrated circuit substrates, in particular to a method for preparing resistance layers of thick-film substrates by using an automatic printing table according to the initial value of resistance, which is suitable for complex thick-film integration with a large number of resistances and large differences in area circuit substrate. Background technique [0002] At present, the resistance layer of the thick-film integrated circuit substrate is generally made by first designing the resistance value and area of ​​the resistance through the layout and function of the circuit substrate, and then performing manual printing, drying, trial firing and measurement according to the required resistance value and area. The design calls for rebatch sintering. Since the resistance characteristics of the slurry are formed after sintering, the film layer is in a non-meta...

AI Technical Summary

Problems solved by technology

Since the resistance characteristics of the slurry are formed after sintering, the film layer is in a non-metallic state before sintering, and the resistance value cannot be measured, but can only be measured after sintering. A large number of long-term resistance tests lead to a decrease in production efficiency

Designers group resistors according to square resistance. Commonly used square resistances are 100Ω, 200Ω, 500Ω, 1k, 5k, 10k, 20k, 100k, and 1M. Therefore, resistors are generally grouped according to square resistance. For complex thick-film integrated circuit substrates , the square resistance is generally more than 4, and each group of resistances includes more than ten or even twenty resistances. There are differences in the resistance area of ​​different resistance values. If the design is only at the theoretical level, it is difficult to ensure that each resistance is printed on the same It can reach the theoretical value under the same conditions and cannot be printed at the same time. It needs to be printed separately and increase the number of printings, which is not conducive to production and quality consistency. This has also become a problem that has plagued the industry for a long time.

[0003] In addition, when printing by hand in the prior art, the uniformity and consistency of the film layer are greatly affected by the skill level of the operator. The process must be tested and tested to measure the resistance value. Minutes, including printing and leveling for 15 minutes, drying for 15 minutes, and sintering for 60 minutes, and a large number of repeated cycle test firings

When the resistance area of ​​the same square resistance is greatly different, the initial value of the resistance is not proportional and does not match, and it cannot be printed at the same time. It needs to be printed in separate screens, increasing the number of printings and taking longer.

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