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Under-bump metal structure, display backboard and display panel

A metal under bump, display backplane technology, applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of solder material overflow, chip cathode and anode short circuit, etc.

Pending Publication Date: 2022-03-25
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the alignment between the metal Pad (electrodes, including cathode and anode) of micro components such as LED chips and the metal structure under the bump in the backplane mainly has the following problems: when the microcomponents are pressed together with the backplane, the solder material overflows and easily causes chip damage. Cathode and anode shorted

Method used

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  • Under-bump metal structure, display backboard and display panel
  • Under-bump metal structure, display backboard and display panel
  • Under-bump metal structure, display backboard and display panel

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Embodiment Construction

[0026] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0028] As mentioned in the background technology, during the micro-component tran...

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PUM

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Abstract

The invention relates to an under-bump metal structure, a display backboard and a display panel. The under bump metal structure comprises a body part and a protruding part, the body part is provided with a first surface and a second surface which are opposite to each other, and the protruding part is located on the second surface and close to one end of the body part. Compared with a flat surface of an under-bump metal structure in the prior art, the solder in the under-bump metal structure needs to cover a larger surface area to overflow out of the under-bump metal structure, so that the under-bump metal structure can alleviate and even avoid the problem that the solder overflows out of the under-bump metal structure when a micro-component and a substrate structure such as a back plate are laminated. And the problem of electrode short circuit caused by the overflow of the welding flux out of the under-bump metal structure is solved. And the protruding part has a certain height, and the solder overflowing on the surface of the protruding part has a backflow phenomenon, so that the backflow of the overflowing solder caused by the overflow of the solder from the micro-component can be further relieved or even avoided, and the problem of short circuit of the cathode and the anode of the micro-component caused by the overflow of the welding material is further relieved.

Description

technical field [0001] The invention relates to the display field, in particular to an under-bump metal structure, a display backplane and a display panel. Background technique [0002] In the manufacturing process of Micro-LED (Micro Light Emitting Diode, micro light-emitting diode) and other micro components, the mass transfer technology has become a difficult point in the preparation of Micro-LEDs. Among them, in the process of mass transfer, micro components such as LED chips and the backplane Accurate alignment of the Under Bump Metal (UBM) structure is one of the key technologies for mass transfer. [0003] At present, the alignment between the metal Pad (electrodes, including cathode and anode) of micro components such as LED chips and the metal structure under the bump in the backplane mainly has the following problems: when the microcomponents are pressed together with the backplane, the solder material overflows and easily causes chip damage. The cathode and anode...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L33/62H01L25/075
CPCH01L24/14H01L33/62H01L25/0753H01L2224/1401H01L2933/0066
Inventor 汪庆范春林王斌
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD