In-situ detection device and in-situ detection method for edge cutting wafer

Abstract

The invention discloses an in-situ detection device and an in-situ detection method for an edge cutting wafer, and the device comprises an inclined hole which is disposed at the top of a bracket; the medium source is communicated with the inclined hole through a pipeline; the pressure sensor is arranged on the pipeline between the inclined hole and the medium source so as to detect the pressure of the pipeline; the control part is connected with the pressure sensor so as to judge whether the wafer is in place or not according to the pressure of the pipeline; wherein the top of the bracket is further provided with a groove overlapped with the inclined hole, a base plate is installed in the groove, and the base plate partially shields the inclined hole to form a detection hole; and if the wafer on the bracket is in place, the wafer partially or completely blocks the detection hole to cause the pressure change of the pipeline.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an in-position detection device and an in-position detection method for edge-cut wafers. Background technique [0002] In the field of semiconductors, it is necessary to perform wafer edge trimming on the edge of the wafer, so that a ring-shaped area with a thinner thickness appears on the edge of the wafer, so as to meet the requirements of wafer manufacturing. [0003] In the chemical mechanical polishing process, the on-site detection of the edge-cut wafer is prone to misjudgment, which affects the normal interaction of the wafer in the wafer exchange device (load cup). specifically: [0004] (1) Due to the requirements of the wafer device area, the accessible area of ​​the wafer is limited to within 2.5mm of the edge; the 2.5mm edge area is not only used for the support of the wafer, but also for the in-position detection of the wafer, utilizing the space ...

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Problems solved by technology

[0005] (2) In order to prevent the device area from being polluted by light, the optical sensor cannot be used for detection;

However, for edge-cut wafers, it is difficult for the wafer to completely cover or mostly cover the water outlet, resulting in a small pressure difference when there is a wafer or not, which can easily cause false alarms and affect the normal interaction of the wafer;

[0007] (4) Since there are many specifications of wafer edge cutting size (trimming size), and the overall replacement of mechanical parts to match wafers of different specifications has the disadvantages of low switching efficiency and high overall cost

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