Ultrasonic contact type flaw detection method for large-thickness part
A flaw detection and ultrasonic technology, which is applied in the analysis of solids by using sound waves/ultrasonic waves/infrasonic waves, material analysis by using sound waves/ultrasonic waves/infrasonic waves, and measuring devices. It can solve problems such as high noise and inaccurate test results, and achieve accurate results. , the effect of simple method
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[0098] Select GH141 as the research object, use different frequency and different wafer diameter probes, determine the instrument parameters, and determine the selection of reasonable probe and instrument parameters according to the analysis of the test results, and optimize the detection process. Carry out flaw detection detection by the inventive method:
[0099] Material GH141 produced by ATI company, specification Ф250 bar flaw detection test
[0100] Ultrasonic flaw detection instrument: Masterscan 700M
[0101] The near-field values of different probes are calculated by formula (1), as follows:
[0102] V104 Frequency 2.25MHz Chip diameter 25mm Near field length N=59.5mm 3N=178mm
[0103] V105 Frequency 2.25MHz Chip diameter 19mm Near field length N=34mm 3N=102mm
[0104] V107 Frequency 5MHz Chip diameter 25mm Near field length N=132mm 3N=396mm
[0105] V108 Frequency 5MHz Chip diameter 19mm Near field length N=76mm 3N=228mm
[0106] V109 Frequency 5MHz Chip diame...
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