Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic chip feeding device and method and assembling equipment

A technology for feeding devices and electronic chips, which is applied to circuits, electrical components, transportation and packaging. The effect of material waiting

Inactive Publication Date: 2022-04-05
孙川川
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to propose an electronic chip feeding device with high chip feeding efficiency and adaptable to different feeding attitude angles in view of the problems in the prior art that the chip feeding efficiency is low, the chip shape is not uniform, and the feeding posture needs to be adjusted. and methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic chip feeding device and method and assembling equipment
  • Electronic chip feeding device and method and assembling equipment
  • Electronic chip feeding device and method and assembling equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] like figure 1 As shown, an electronic chip assembly equipment includes a frame 1 and a conveying device 2 installed on the frame 1, a chip feeding device 3, a gluing device 4, a screwing device 5 and a feeding device 6; the conveying The device 2 is a turntable type, and the conveying device 2 is provided with a chip feeding station, a gluing station, a radiator feeding station, a screwing station and a blanking station in sequence, and the chip feeding device 3 corresponds to the chip supplying station. Material station, gluing device 4 corresponds to the gluing station, a feeding manipulator is provided at the radiator feeding station, screw screwing device 5 corresponds to the screwing station, and unloading device 6 corresponds to the unloading station; the conveying device 2 There is a carrier in it, one carrier can place two electronic chips, there are two groups of chip feeding device 3, and two groups of screwing device 5, which can carry out feeding and assembli...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electronic chip feeding device which comprises a bottom frame, a rotary stock bin assembly, an arc-shaped material passing rail, a material moving assembly, a shaping assembly, a pin cutting assembly, a carrying assembly and a direction adjusting assembly. The bottom frame comprises an upper platform and a lower platform, the rotary stock bin assembly is installed on the upper platform, and the material moving assembly is installed on the lower platform. The upper end of the arc-shaped material passing rail is vertical and connected with the discharging end of the rotary stock bin assembly. The lower end of the arc-shaped material passing rail is horizontal and connected with the feeding end of the material moving assembly. The shaping assembly and the pin cutting assembly are arranged on the side of the material moving assembly, the direction adjusting assembly is installed on the lower platform, and the carrying assembly is connected with the discharging end of the material moving assembly and the direction adjusting assembly. The chip feeding device has the advantages of being high in chip feeding efficiency and suitable for different feeding attitude angles.

Description

technical field [0001] The invention relates to the technical field of electronic component production, in particular to an electronic chip feeding device, method and assembly equipment. Background technique [0002] In household appliances, such as televisions, refrigerators, etc., in order to achieve a good heat dissipation effect for the integrated circuit chip (IC) on the internal circuit board, the IC is mounted on a heat sink. At present, apply heat dissipation glue to the IC first, then place the IC in the fixing hole of the heat sink, and finally fix the screws with an air batch or electric batch. like Figure 15 The electronic chip shown consists of a chip (100) and a heat sink (200). [0003] Chinese invention patent application (publication number: CN101521149B, publication date: 2011.01.12) discloses an automatic assembly device for assembling IC chips and radiators, which includes: a base; a control circuit driven by a microprocessor Radiator loading device, h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
Inventor 孙川川
Owner 孙川川