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Plasma reactor

A plasma and reactor technology, used in discharge tubes, electrical components, circuits, etc., can solve the problems of many dead ends, high processing costs, long processing cycles, etc., to eliminate dead ends, save processing costs, and improve utilization. Effect

Pending Publication Date: 2022-04-08
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The structural schematic diagram of the plasma reactor in the prior art is as figure 1 As shown, after the processing gas is input into the inner cavity, it is discharged from the exhaust hole of the pumping ring; the structural schematic diagram of the pumping ring in the prior art is shown in figure 2 As shown, it is an integrated structure. However, with the change of process conditions, the structure of the pumping ring becomes more complicated, and there are many processing dead angles. Therefore, there are problems of high processing cost and long processing cycle. In addition, when changing process conditions, The pumping ring needs to be completely replaced to meet different process requirements. Different process requirements require different pumping rings, resulting in low overall utilization of the pumping ring, and idle pumping rings will occupy unnecessary maintenance costs.

Method used

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Embodiment Construction

[0045] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the present invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. As used herein, "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other el...

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Abstract

The invention provides a plasma reactor which comprises a reactor chamber, and the reactor chamber is provided with a first air exhaust ring, a second air exhaust ring, a nozzle panel and a heater. The nozzle panel is used for spraying plasma to the reactor chamber; the first air exhaust ring is matched with the second air exhaust ring; the second air exhaust ring is matched with the heater; a plurality of through holes are formed in the second air exhaust ring, and the through holes penetrate through the second air exhaust ring; and the heater is used for providing a temperature condition for plasma reaction. The plasma reactor is used for simplifying the machining process, eliminating machining dead angles, saving machining cost, facilitating replacement of process working conditions and improving the utilization rate of an air exhaust structure.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a plasma reactor. Background technique [0002] The structural schematic diagram of the plasma reactor in the prior art is as figure 1 As shown, after the processing gas is input into the inner cavity, it is discharged from the exhaust hole of the pumping ring; the structural schematic diagram of the pumping ring in the prior art is shown in figure 2 As shown, it is an integrated structure. However, with the change of process conditions, the structure of the pumping ring becomes more complicated, and there are many processing dead angles. Therefore, there are problems of high processing cost and long processing cycle. In addition, when changing process conditions, The pumping ring needs to be completely replaced to meet different process requirements. Different process requirements require different pumping rings, resulting in low overall utilization of the pumping ring,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
Inventor 王燚陈新益吴凤丽李培培张亚梅
Owner PIOTECH CO LTD
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