Full-automatic silicon wafer cleaning and spin-drying equipment

A fully automatic silicon wafer cleaning technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of inconvenient drying of silicon wafers and unclean cleaning of silicon wafers, and achieve the effect of accelerating drying, solving the problems of inconvenient drying, Effect of improving cleaning efficiency

Pending Publication Date: 2022-04-12
王鹏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the purpose of the present invention is to provide a fully automatic cleaning and drying equipment for silicon wafers to solve the technical problems of unclean silicon wafer cleaning and inconvenient drying of silicon wafers

Method used

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  • Full-automatic silicon wafer cleaning and spin-drying equipment
  • Full-automatic silicon wafer cleaning and spin-drying equipment
  • Full-automatic silicon wafer cleaning and spin-drying equipment

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0034] The embodiments of the present invention will be described below according to the overall structure of the present invention.

[0035] A fully automatic cleaning and drying equipment for silicon wafers, such as Figure 1 to Figure 9As shown, the cleaning box 1 is included, and the inside of the cleaning box 1 is provided with multiple groups of cleaning chambers 101. The inside of each group of cleaning chambers 101 is equipped with a water spray mechanism 7, and the top of the water spray mechanism 7 is provided with multiple groups of nozzles 701. The bottom of the water mechanism 7 is equip...

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Abstract

The invention discloses full-automatic silicon wafer cleaning and spin-drying equipment, and relates to the field of silicon wafer production. Comprising a cleaning box, a plurality of cleaning bins are formed in the cleaning box, a water spraying mechanism is installed in each cleaning bin, a sliding rail is connected to the upper portion of the cleaning box, a moving mechanism is arranged below the sliding rail, and a hanging basket is connected to the bottom end of the moving mechanism in a hanging mode. According to the silicon wafer cleaning device, through the arrangement of the hanging basket, the motor and the mounting column, after silicon wafers in the hanging basket are cleaned, the hanging basket is moved to the position near the mounting column through the moving mechanism, the hanging basket is clamped to the mounting column through the fixing rod, the motor is started, and the motor drives the hanging basket to rotate through the mounting column; when the hanging basket rotates, water in the hanging basket is discharged through the water discharging inclined opening under the action of centrifugal force, when the hanging basket rotates, the hanging basket drives outside air to enter the air groove formed in the hanging basket through the first air inlet and the second air inlet formed in the two sides, and airflow is discharged through the intercepting net to air the outer side of the silicon wafer.

Description

technical field [0001] The invention relates to the field of silicon wafer production, in particular to a fully automatic cleaning and drying equipment for silicon wafers. Background technique [0002] Silicon is a semiconductor material, and its own conductivity is not very good. However, its resistivity can be precisely controlled by adding the appropriate dopants. Before semiconductors can be made, silicon must be converted into silicon wafers. In the production of silicon wafers, polysilicon is usually mixed with multiple sets of other raw materials and Melt and mix in the crucible, form silicon ingots after cooling, and cut the silicon ingots into groups of silicon wafer blanks, and form the required silicon wafers after grinding. [0003] After the silicon wafer is produced, there is usually a lot of dust and damage attached to the surface, and it is usually necessary to clean the silicon wafer. The existing cleaning method usually puts the silicon wafer into the hang...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 王鹏
Owner 王鹏
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