Flexible circuit board, display module and display device

A technology for flexible circuit boards and display panels, which can be used in identification devices, printed circuit components, cooling/ventilation/heating transformation, etc. It can solve the problems of reducing the production efficiency of display devices and spending more time, so as to save attachment time , Improve production efficiency and simplify the preparation process

Pending Publication Date: 2022-04-12
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] From the above heat dissipation film attachment process, it can be seen that the process involved in the process of attaching the heat dissipation film to the back of the display panel must be kept clean, the alignment between the display panel and the heat dissipation film, and the alignment between the display panel and the heat dissipation film. Attaching will take more time, which will easily reduce the production efficiency of the display device

Method used

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  • Flexible circuit board, display module and display device
  • Flexible circuit board, display module and display device
  • Flexible circuit board, display module and display device

Examples

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Embodiment Construction

[0040] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments provided in the present disclosure belong to the protection scope of the present disclosure.

[0041] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is interpreted in an open and inclusive sense, ie "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example" or "some examples" are intended to indicate specific features, structures related to the embodiment or examples , material or characteristic is included in at least one embodiment or example of the p...

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PUM

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Abstract

The embodiment of the invention discloses a flexible circuit board, a display module and a display device, relates to the technical field of display, and is used for simplifying the manufacturing process of the display device. The flexible circuit board is provided with a heat dissipation area and a wiring area; the flexible circuit board comprises an anti-film printing layer, a first heat dissipation layer and a first wiring layer which are arranged on one side of the anti-film printing layer, and a second heat dissipation layer and a second wiring layer which are arranged on the other side of the anti-film printing layer. The first heat dissipation layer and the second heat dissipation layer are located in the heat dissipation area, and the first wiring layer and the second wiring layer are located in the wiring area. Wherein the first heat dissipation layer and the first wiring layer are arranged on the same layer; the second heat dissipation layer and the second wiring layer are arranged on the same layer. The flexible circuit board, the display module and the display device provided by the embodiment of the invention are used for image display.

Description

technical field [0001] The present disclosure relates to the field of display technology, in particular to a flexible circuit board, a display module and a display device. Background technique [0002] In the manufacturing process of some display modules, a heat dissipation film is usually attached to the non-light-emitting side of the display panel, so that the heat dissipation film can release the static electricity and heat accumulated in the display panel and protect the display panel. [0003] see figure 1 , in the process of attaching the heat dissipation film to the non-light-emitting side of the display panel, the display panel and the heat-dissipation film can be loaded separately, and then the heat dissipation film is attached to the non-light-emitting side of the display panel. For example, after the display panel is supplied, the display panel can be loaded onto the attaching device, then the back of the display panel (that is, the surface of the display panel a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20G09F9/30
Inventor 钱正坤王奉献毕鑫
Owner BOE TECH GRP CO LTD
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