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Intelligent disassembling method and device for waste high-value circuit board chip

A circuit board, high-value technology, applied in the field of resources and environment, can solve the problems of few recycling chains, narrow selection of dismantling chips, slow chip disassembly, etc. Effect

Active Publication Date: 2022-04-15
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with a large number of obsolete mobile phones deposited, on the contrary, the recycling rate of obsolete mobile phones in my country is less than 2%, and most of the obsolete mobile phones in China are recycled in the form of waste products, and there are few professional recycling chains
However, the chip disassembly speed of this solution is slow (according to the patent introduction, the disassembly time exceeds 40 seconds), and the selection of disassembled chips is narrow

Method used

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  • Intelligent disassembling method and device for waste high-value circuit board chip
  • Intelligent disassembling method and device for waste high-value circuit board chip
  • Intelligent disassembling method and device for waste high-value circuit board chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Taking the Huawei P9 mainboard chip as the dismantling target, after adjusting the width of the feeding movable guide rail 106 to 66mm, guide the three positioning points on the mainboard surface into the upper computer of the back-end chip dismantling and sorting unit 003, and at the same time place the upper part of the mainboard CPU chip The metal shield, the location marks of the CPU and memory chips. Firstly, the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 is set to 230°C, and the temperature of the heating bottom plate 501 of the heat preservation heating platform 005 is set to 235°C. Put the main board of the mobile phone into the fixed guide rail 103 in sequence, and turn it on to prepare for heating operation. After the temperature of the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end heat preservation and heating platf...

Embodiment 2

[0051] Taking the Huawei P9 mainboard chip as the dismantling target, after adjusting the width of the feeding movable guide rail 106 to 66mm, guide the three positioning points on the mainboard surface into the upper computer of the back-end chip dismantling and sorting unit 003, and at the same time place the upper part of the mainboard CPU chip The metal shield, the location marks of the CPU and memory chips. Firstly, the temperature 105 at the outlet of the heat treatment unit 001 is set to 240°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 245°C. Put the main board of the mobile phone into the fixed guide rail 103 in sequence, and turn it on to prepare for heating operation. After the temperature of the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end heat preservation and heating platform 005 in turn, the r...

Embodiment 3

[0053]Taking the Huawei P9 mainboard chip as the dismantling target, after adjusting the width of the feeding movable guide rail 106 to 66mm, guide the three positioning points on the mainboard surface into the upper computer of the back-end chip dismantling and sorting unit 003, and at the same time place the upper part of the mainboard CPU chip The metal shield, the location marks of the CPU and memory chips. First, set the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 to 250°C, and set the temperature of the heating base plate 501 of the heat preservation heating platform 005 to 255°C. Put the main board of the mobile phone into the fixed guide rail 103 in sequence, and turn it on to prepare for heating operation. After the temperature of the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end heat preservation and heating platform 005 in ...

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Abstract

The invention discloses an intelligent disassembling method and device for a waste high-value circuit board chip. The device comprises a heating treatment unit and a chip disassembling and sorting unit, the heating treatment unit realizes slow increase of the temperature of the circuit board through gradient temperature rise, prevents thermal stress damage caused by overlarge temperature difference, and ensures that the surface temperature of the circuit board can reach a temperature control point of an optimal disassembling effect at a pretreatment outlet through temperature closed-loop control; the chip disassembling and sorting unit is arranged behind the heating treatment unit and comprises a heat preservation heating platform, the rotary clamp grabs the circuit board entering the heat preservation heating platform, and the camera determines the specific position of a chip to be disassembled on the circuit board through a front-designed positioning point. And each component is reversely sucked, classified and recycled through the vacuum chuck, so that the purposes of non-destructive disassembly and extraction of high-value chips are achieved. The circuit board disassembling device is high in automation degree, high in chip disassembling yield and wide in circuit board model disassembling adaptation range.

Description

technical field [0001] The invention belongs to the technical field of resources and environment, and in particular relates to a method and device for intelligent dismantling of waste high-value circuit board chips. Background technique [0002] With the rapid development of smart phones, people's lives are becoming more and more convenient. Mobile phones are closely related to all aspects of life and are playing an increasingly important role in daily life. According to the statistics of IDC, a well-known international data company, the global mobile phone shipments in 2019 were 1.486 billion units, of which the total shipments of China's mobile phone market were 370 million units, accounting for 24.90% of the world's total shipments. The industry predicts that in the next few years, the number of updated mobile phones in China will reach 400 million each year, and 100 to 200 million mobile phones will be discarded every year. Before that, my country has deposited about 1 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCY02W30/82
Inventor 蒋晨龙张承龙黄庆马恩章金宇王瑞雪许剑峰蒋建航陈登峰王景伟
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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