Polishing solution splash-proof device for chemical mechanical polishing and chemical mechanical polishing equipment
A chemical machinery and polishing liquid technology, applied in grinding/polishing equipment, grinding equipment, metal processing equipment, etc., can solve the problems of reducing the yield of wafers, difficult to clean, and scratching the wafer surface.
Active Publication Date: 2022-04-19
HWATSING TECH
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- Abstract
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- Claims
- Application Information
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Problems solved by technology
The polishing liquid splashes to various parts of the polishing space, making it difficult to clean up completely
The polishing liquid crystallizes particles in the polishing space, even very small particles will become a source of pollution to the entire working environment, which may cause scratches on the wafer surface and reduce the yield of wafers
Method used
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[0027] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternat...
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Abstract
The invention discloses a polishing solution splash-proof device for chemical mechanical polishing and chemical mechanical polishing equipment, and the polishing solution splash-proof device comprises an annular check ring which is arranged on the peripheral side of a polishing disc in a surrounding mode, is provided with a lifting mechanism and can independently move in the vertical direction to shield sputtered polishing solution; and the flow guide groove assembly is located below the annular check ring and the polishing disc, labyrinth seal is formed by the flow guide groove assembly and the annular check ring so as to shield a gap between the bottom of the annular check ring and the polishing disc, and therefore the flow guide groove assembly is used for collecting liquid.
Description
technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing liquid splash prevention device for chemical mechanical polishing and chemical mechanical polishing equipment. Background technique [0002] In the production process of large-scale integrated circuits, the removal and planarization of substances on the wafer surface is a necessary and frequently used process. Currently, chemical mechanical polishing is the most effective global planarization technique. During chemical mechanical polishing, the centrifugal force generated by the rotation of moving parts such as the carrier head and the polishing plate will throw the polishing solution from the polishing pad. The polishing liquid splashes to various parts of the polishing space, and it is difficult to clean it completely. The polishing liquid crystallizes out particles in the polishing space, and even very small particles will become a source of...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B24B37/34B24B57/02B24B37/10B24B53/017
CPCB24B37/34B24B57/02B24B37/107B24B53/017
Inventor 梁清波王同庆
Owner HWATSING TECH