Laser cutting method and device based on assembly line and storage medium
A laser cutting and assembly line technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as laser cutting operation restrictions
Pending Publication Date: 2022-04-22
SHENZHEN TETELASER TECH CO LTD
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Problems solved by technology
[0003] The main purpose of the present invention is to provide a laser cutting method based on an assembly line, aiming to solve the technical problem that the laser cutting operation in the prior art is limited by graphics and mechanisms
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[0044] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0045] refer to figure 1 , figure 1 It is a schematic structural diagram of a device in a hardware operating environment involved in the solution of the embodiment of the present invention.
[0046] Such as figure 1 As shown, the running device may include: a processor 1001 , such as a central processing unit (Central Processing Unit, CPU), a communication bus 1002 , a user interface 1003 , a network interface 1004 , and a memory 1005 . Wherein, the communication bus 1002 is used to realize connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standa...
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The invention discloses a laser cutting method and device based on an assembly line and a storage medium, and belongs to the technical field of laser cutting, and the assembly line continuously runs in the laser cutting operation process of a target pattern of a to-be-cut piece. Dividing the to-be-cut piece into a plurality of cutting areas to obtain sub-patterns of the cutting areas; the assembly line is operated, and whether the cutting area flows into a laser cutting breadth of laser cutting equipment or not is judged; and if yes, laser cutting operation of the sub-pattern is conducted on the cutting area of the to-be-cut piece in the laser cutting breadth. During drawing, a target pattern is divided into a plurality of cutting areas, and it is guaranteed as much as possible that the laser cutting time of the divided cutting areas is equal. The assembly line continuously operates in the laser cutting operation process of the target pattern of the to-be-cut piece, so that the laser cutting breadth is not limited by the size of the mechanism and a motion platform.
Description
technical field [0001] The present invention relates to the field of laser cutting, in particular to an assembly line-based laser cutting method, equipment and computer-readable storage medium. Background technique [0002] At present, when the existing laser cutting equipment cuts large-format products, the large-format graphics are divided into small-format graphics in advance, and then the translation table is used to move and coordinate, and the small-format graphics are spliced into large-format graphics. However, there are technical defects: the graphic format is limited by the size of the mechanism and the movement stroke of the translation platform. The larger the graphics, the greater the required movement stroke, and the larger the mechanism. Contents of the invention [0003] The main purpose of the present invention is to provide a laser cutting method based on an assembly line, aiming to solve the technical problem in the prior art that the laser cutting ope...
Claims
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IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/70
Inventor 王双农积宇黄冠周红林贾长桥张智洪盛辉周学慧张凯
Owner SHENZHEN TETELASER TECH CO LTD