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Supporting structure of three-dimensional packaging intelligent detection analyzer

A technology of intelligent detection and three-dimensional packaging, applied in instruments, supporting machines, measuring devices, etc., can solve the problems of inability to protect the detector, reduce the service life of the detector, lack of elastic buffer structure, etc., and achieve the effect of promoting heat dissipation.

Active Publication Date: 2022-04-22
徐州盛科半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies in the prior art, the present invention provides a support structure for a three-dimensional packaging intelligent detection analyzer, which solves the problem that in the process of making chips by semiconductor processing, it is necessary to use Intelligent detection analyzers, most of the existing analyzers cooperate with three-dimensional packaging for centralized detection, and most of the support structures in the detection process are fixed installations, lacking elastic buffer structures, and unable to provide safety protection for the detectors. At the same time, the lack of heat dissipation structures reduces the detection The problem of the service life of the instrument

Method used

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  • Supporting structure of three-dimensional packaging intelligent detection analyzer
  • Supporting structure of three-dimensional packaging intelligent detection analyzer
  • Supporting structure of three-dimensional packaging intelligent detection analyzer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1, the cushioning structure includes a female tube-17, a sub-rod-18 is inserted inside the female tube-17, and a compression spring-19 is arranged inside the female tube-17, and the outer end of the sub-rod-18 is connected with a The arc-shaped pressing plate-20 can reach elastic buffering by using the pressing plate-20 to squeeze the compression spring-19 inside the sub-rod-18.

Embodiment 2

[0038] Embodiment 2, the cushioning structure includes a mother pipe 21, the outer side of the mother pipe 21 is connected with a sub-rod 22, the outer end of the sub-rod 22 is connected with a convex ball 23, and the outer side of the convex ball 23 is provided with a pressure plate 224, A concave frame 25 is also arranged on the inner side of the pressing plate 24, and the convex ball 23 is embedded in the inside of the concave frame 25. Several stage clips 26 are arranged on the outer wall of the convex ball 23, and the stage clip 26 is in contact with the inner wall of the concave frame 25. Connection, through such a design, the pressure plate 2 24 can be used to contact the detector, by using the convex ball 23 to squeeze the pressure spring 2 26 and the inner part of the concave frame 25 shakes, so as to achieve the effect of buffering.

[0039] A fan one 27 is also arranged at the center of the cavity of the base plate 1, and the outside of the fan one 27 is connected wi...

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Abstract

The invention discloses a supporting structure of a three-dimensional packaging intelligent detection analyzer, which comprises a base disc, a plurality of lifting rods arranged at the bottom end of the base disc, the base disc is in a disc shape, a columnar cavity groove is formed in the center of the base disc, and a plurality of elastic bent rods are arranged at the top of the base disc at equal intervals. The tops of the bent rods are jointly connected with a strip-shaped frame, the strip-shaped frame is in a cuboid shape and is hollow, tightening assemblies are symmetrically arranged on the two sides of the top of the strip-shaped frame, each tightening assembly comprises a protruding strip, two casting blocks are symmetrically arranged on the top of each protruding strip in the front-back direction, and threaded pipes are arranged on the casting blocks; a threaded rod is arranged in the threaded pipe, a linkage rod is arranged in the middle of the threaded rod, a transverse plate is arranged at the outer end of the linkage rod, and a plurality of buffering structures are connected to the outer side of the transverse plate. According to the invention, the analyzer can be rapidly detected, supported and fixed, elastic protection can be carried out, and the device is relatively practical.

Description

technical field [0001] The invention relates to the technical field of semiconductor chips, in particular to a support structure for a three-dimensional packaging intelligent detection analyzer. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. [0003] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. [0004] No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F15/04F16F15/067F16M11/04G01K13/024H05K7/20
CPCF16F15/04F16F15/067F16M11/04G01K13/024H05K7/20172
Inventor 廖广兰
Owner 徐州盛科半导体科技有限公司