A computer motherboard with integrated heat dissipation

Abstract

The invention relates to the technical field of computer motherboards, and discloses a computer motherboard with integrated heat dissipation, comprising a motherboard chassis and a motherboard body disposed inside the motherboard chassis. The motherboard chassis is provided with a heat dissipation mechanism, and the heat dissipation mechanism includes a centralized heat dissipation device and a motherboard heat dissipation device. The motherboard cooling device includes a motherboard cooling air duct and a water cooling auxiliary cooling component. The motherboard cooling device has a two-stage cooling mode. The first-level cooling mode is a low-power mode. By making the motherboard cooling device operate at low power. The air blown in by the two sets of dust-removing and air-inlet components is collected through the air collecting hood, and then the air exhaust holes set on the air collecting hood are introduced into the motherboard chassis to dissipate heat inside the motherboard chassis as a whole. Under the condition of high temperature alarm, when the motherboard body issues a high temperature alarm during use, the heat dissipation mechanism will use the second-level heat dissipation mode to dissipate heat for the motherboard body to achieve the fastest speed so that the motherboard body can dissipate heat.

Description

technical field [0001] The invention relates to the technical field of computer motherboards, in particular to a computer motherboard with integrated heat dissipation. Background technique [0002] Mainboard, also known as mainboard, systemboard or motherboard; it is installed in the chassis and is one of the most basic and most important components of a microcomputer. The main board is generally a rectangular circuit board, on which the main circuit systems that make up the computer are installed, generally including BIOS chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. [0003] At present, due to the increasingly powerful computing functions, the temperature of the computer motherboard is higher when working, especially in some special environments, such as poor air flow and high ambient temperature, real-time cooling is required. N...

AI Technical Summary

Problems solved by technology

[0003] At present, due to the increasingly powerful computing functions, the temperature of the computer motherboard is higher, especially in some special environments, such as poor air flow and high ambient temperature, which require real-time heat dissipation and cooling processing. The heat dissipation effect of the current computer mainframe chassis Not ideal, most of them use air cooling to dissipate heat. This cooling method may cause a large amount of heat to accumulate inside the mainframe chassis. Although some mainframe chassis use water cooling for heat dissipation, the water cooling method is through the inside of the chassis. Using water pipes, the water flows through the pipes in the chassis to take away part of the temperature in the chassis. Although this method can achieve a cooling effect, when the surrounding environment is high, the temperature of the water flow also increases, which reduces the cooling effect; In the prior art, there is no device that can flexibly switch between air cooling and water heating, and adopt different levels of heat dissipation capacity for different heat levels to dissipate heat

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