Packaging welding structure of semiconductor device
A technology for welding structures and semiconductors, applied in semiconductor/solid-state device manufacturing, welding equipment, auxiliary devices, etc., can solve problems such as loss of viscosity of glue, affecting the firmness of the connection between wafers and substrates, and achieve the effect of avoiding excessively high welding temperature.
Inactive Publication Date: 2022-04-29
深圳市优尚至科技有限公司
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Problems solved by technology
In this process, since the connection between the chip and the substrate is done by pasting, when the soldering temperature is too high, the glue will lose its viscosity, which will affect the firmness of the connection between the chip and the substrate. Therefore, it is necessary to design a new semiconductor soldering package structure , able to precisely control the temperature during soldering, to avoid excessive soldering temperature resulting in weak connection between the chip and the substrate
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[0043] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0044] An embodiment of the present invention provides a package welding structure of a semiconductor device, such as figure 2 As shown, it includes: a substrate 1, a chip 2, a welding head 3, a temperature sensor 4 and an alarm 41, the chip 2 is arranged on the substrate 1, and the welding head 3 is connected to the chip 2 facing the substrate 1 The temperature sensor 4 is fixedly arranged on the substrate 1 near the connection between the substrate 1 and the wafer 2 , and the alarm 41 is fixedly arranged on the substrate 1 and electrically connected to the temperature sensor 4 .
[0045] The working principle and beneficial technical effects of the above-mentioned ...
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The invention provides a packaging and welding structure of a semiconductor device, which comprises a substrate, a wafer, a welding head, a temperature sensor and an alarm, and is characterized in that the wafer is arranged on the substrate, the welding head is right opposite to the joint of the substrate and the wafer, the temperature sensor is fixedly arranged on the substrate and is close to the joint of the substrate and the wafer, and the alarm is arranged on the substrate. And the alarm is fixedly arranged on the substrate and is electrically connected with the temperature sensor. The invention aims to provide the packaging welding structure of the semiconductor device, so that the situation that the wafer and the substrate are not firmly connected due to the fact that the welding temperature is too high is avoided.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging technology, in particular to a packaging and welding structure of a semiconductor device. Background technique [0002] In the semiconductor manufacturing process, after the wafer processing is completed and tested, the wafer needs to be cut into small chips according to the requirements, and then the cut chips are attached to the corresponding substrate and the pins are soldered , followed by encapsulation. In this process, since the connection between the chip and the substrate is done by pasting, when the soldering temperature is too high, the glue will lose its viscosity, which will affect the firmness of the connection between the chip and the substrate. Therefore, it is necessary to design a new semiconductor soldering package structure , can precisely control the temperature during soldering, so as to avoid the connection between the chip and the substrate is not strong due...
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IPC IPC(8): H01L21/67B23K1/00B23K3/00B23K3/08
CPCB23K1/0016B23K3/00B23K3/08H01L21/67121H01L21/6715
Inventor 万琴华
Owner 深圳市优尚至科技有限公司