Heat dissipation plug-in box with thermal interface material linkage application function

Abstract

The invention discloses a heat dissipation subrack with a thermal interface material linkage application function. The heat dissipation subrack comprises an upper cold plate, a lower cold plate, a side plate, a VPX module, a locking mechanism and a thermal interface material linkage application device. The upper cold plate and the lower cold plate are provided with array step protrusions, the upper cold plate, the lower cold plate and the side plates are welded to form a cavity, the step protrusions of the upper cold plate and the step protrusions of the lower cold plate form inserting grooves, the thermal interface material linkage applying device is fixed to one sides of the inserting grooves, and the locking mechanism is fixed to the other sides of the inserting grooves. The thermal interface material linkage applying device uniformly applies thermal interface materials to the surfaces of the VPX modules when the VPX modules are pushed into the plug-in box along the slots, and the VPX modules are oppositely plugged in place and then the locking mechanism is screwed, so that a low-thermal-resistance transmission path from the VPX module shell to the upper cold plate and the lower cold plate is formed. The heat dissipation plug box provided by the invention can realize automatic, quantitative and uniform application of a thermal interface material when the VPX module is repeatedly plugged and unplugged, the heat dissipation capability is enhanced, and the heat dissipation reliability is improved.

Description

technical field [0001] The invention relates to the technical field of thermal management of electronic equipment. Background technique [0002] As the structure and heat dissipation carrier of electronic devices, subracks are widely used in communication, national defense and other fields. With the rapid development of electronic information technology, the heat flux density and heat dissipation of electronic devices are rapidly increasing, and at the same time, the volume and weight requirements of the cooling system are becoming more and more stringent. The traditional air-cooled VPX sub-box has limited heat dissipation capacity per unit volume. It is difficult to meet the temperature control requirements of subsequent high-performance products, and liquid-cooled subracks have gradually become the key direction of technological development in the next stage. [0003] The Chinese utility model patent with the publication number "202603120U" discloses a heat dissipation su...

AI Technical Summary

Problems solved by technology

But there are also the following defects: 1. There are two kinds of heterogeneous materials, a thermal pad and a U-shaped plate, between the plug-in block and the sub-box, and there are three heat transfer interfaces, especially the metal dry contact between the U-shaped plate and the sub-box , additionally introduces the contact thermal resistance

2. The thickness of the soft thermal pad is limited, and the overall heat transfer resistance cannot be greatly reduced

3. After repeated plugging and unplugging, the soft thermal pad is prone to plastic deformation, which affects the heat transfer effect

[0004] Patent (CN106102418B) discloses a high-efficiency heat dissipation device and method for a liquid-cooled VPX chassis based on a vapor chamber. This patent needs to manually add a thermal interface material between the vapor chamber and the liquid-cooled cold plate. Too much, too little, or evenness has a great influence on the actual contact thermal resistance, and it is easy to ignore that the thermal interface material must be re-laid each time during multiple plugging and unplugging. Therefore, the manual addition method has high requirements for front-line operators and is not conducive to heat dissipation Long-term stable and reliable operation of the box

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