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High-frequency circuit board and manufacturing method thereof

A high-frequency circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc., can solve the problems affecting the signal transmission quality of circuit boards, signal interference, etc., to shield interference and improve transmission quality. Effect

Pending Publication Date: 2022-05-06
KUSN HULI MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The lines in the printed circuit board are relatively dense, resulting in a certain degree of interference between the signals in the line, which affects the signal transmission quality of the circuit board

Method used

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  • High-frequency circuit board and manufacturing method thereof
  • High-frequency circuit board and manufacturing method thereof
  • High-frequency circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0020] A method for manufacturing a high-frequency circuit board, comprising the steps of making a sub-board whose conductor material has the function of preventing signal interference; adding layers and laminating the daughter board having the function of preventing signal interference to form a mother board; The third via hole through which the conductor material is connected.

[0021] Such as Figure 1~Figure 3 As shown, the sub-board made of conductor material with anti-signal interference function includes:

[0022] (1) Make at least one first via hole A on the daughter board, such as figure 1 shown;

[0023] (2) Fill the first via hole A with insulating material by means of a resin plug hole, and then brush it flat;

[0024] (3) Making a second via hole B on the insulating material, wherein the diameter of the second via hole B is smaller than the diameter of the first via hole A, and the distance between the first via hole A and the second via hole B is Axis coincid...

Embodiment 2

[0031] Based on the manufacturing method of a high-frequency circuit board described in Embodiment 1, this embodiment provides a high-frequency circuit board, including a mother board formed by adding layers and laminating a sub-board whose conductor material has the function of preventing signal interference. board, the sub-board has a first via hole filled with an insulating material, and a second via hole filled with a conductive material; the motherboard is provided with at least one third via connected to the conductive material hole; the axes of the first via hole, the second via hole, and the third via hole are coincident, and the diameters of the second via hole and the third via hole are smaller than the diameter of the first via hole ; the insulating material is resin; the conductor material is electroplated copper; the third via hole is filled with conductor material.

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PUM

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Abstract

The invention discloses a high-frequency circuit board and a manufacturing method thereof in the technical field of printed circuit boards. The manufacturing method comprises the following steps: manufacturing a sub-board with a conductor material having a signal interference prevention function; carrying out layer adding on the daughter board of which the conductor material has a signal interference prevention function, and carrying out lamination to form a mother board; and manufacturing a third via hole communicated with the conductor material on the mother board. The daughter board with the conductor material having the signal interference prevention function is manufactured, then the daughter board is subjected to layer adding and pressing to form the mother board, the third via hole communicated with the conductor material is manufactured in the mother board, interference in the signal transmission process can be effectively shielded, and the signal transmission quality is improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a high-frequency circuit board and a manufacturing method thereof. Background technique [0002] The lines in the printed circuit board are relatively dense, which leads to a certain degree of interference between the signals in the line, which affects the signal transmission quality of the circuit board. Contents of the invention [0003] In order to solve the deficiencies in the prior art, the present invention provides a high-frequency circuit board and a manufacturing method thereof, which have the characteristics of small signal interference and the like. [0004] In order to achieve the above object, the technical scheme adopted in the present invention is: [0005] In the first aspect, a method for manufacturing a high-frequency circuit board is provided, including: making a sub-board whose conductor material has the function of preventing sig...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0237H05K1/0222H05K3/0058H05K3/0094
Inventor 余丞博王永海
Owner KUSN HULI MICROELECTRONICS