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Non-contact glue-pressing type glue dipping device used in winding forming process

A non-contact, winding forming technology, applied in the field of non-contact pressing glue type dipping devices, can solve the problems of difficult glue content control, wound material damage, inconvenient operation, etc., to reduce environmental pollution and material waste, easy to Operation and cleaning, the effect of reducing the volatilization area

Pending Publication Date: 2022-05-10
CHANGCHUN EQUIP TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve technical problems such as damage to the winding material, affecting the tension control of the winding process, difficulty in controlling the glue content, complex structure of the dipping device, inconvenient operation, and environmental pollution in the existing dipping process, the present invention provides a Non-contact pressure glue type dipping device in winding molding process

Method used

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  • Non-contact glue-pressing type glue dipping device used in winding forming process
  • Non-contact glue-pressing type glue dipping device used in winding forming process
  • Non-contact glue-pressing type glue dipping device used in winding forming process

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Embodiment Construction

[0031] exist figure 1Among them, a non-contact glue-pressing type dipping device used in the winding molding process is characterized in that: the device includes: a dipping mechanism 1, a synchronous opening and closing drive mechanism 2; the dipping mechanism 1 includes: a pressing block 6 , Mandrel 7, Mandrel 8, Briquetting block 9, Inlet hose 20, Squeegee 21, Wrapping material 22, Squeegee 23, Squeegee 24, Squeegee 25, Outlet hose 26, Inlet hose 27, Outlet Rubber hose 28; synchronous opening and closing drive mechanism 2 includes: bracket 3, optical axis 4, slider 5, slider 10, bracket 11, base 12, cylinder bracket 13, connecting rod 14, sliding sleeve 15, guide post 16, nut 17 , cylinder 18, connecting rod 19. The briquetting block 6 and the core mold 7 are sealed with an O-ring, positioned by the groove on the briquetting block 6, and fixed by screws; the briquetting block 9 and the core mold 8 are sealed by an O-ring, and positioned by the groove on the briquetting blo...

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Abstract

A non-contact glue pressing type glue dipping device used in a winding forming process is particularly suitable for glue dipping processing of various winding materials such as fibers, fiber bundles, belts and complex sections in the winding process, and a channel with small and uniform gaps is formed by a mould capable of being opened and closed and the winding materials. Glue is injected into the channel from glue injection holes in the mold, the channel is filled with the glue under the action of pressure, the winding material in the channel is soaked in the glue, the glue injection pressure and flow speed are controlled according to the linear speed of the winding material, and meanwhile the distribution condition of the glue injection holes in the inner wall of the channel in the mold is reasonably designed; the movement mechanism of the device is driven by an air cylinder to drive a synchronous movement mechanism, automatic synchronous opening and closing of the mold can be achieved, the winding material can stop impregnation at any time conveniently, the device can be installed on various winding machines, and the winding material surface impregnation amount and uniformity can be controlled. And accurate control of gluing homogeneity of glue dipping processing in a winding process is realized.

Description

technical field [0001] The invention relates to a non-contact glue-pressing type dipping device used in the winding forming process, which is especially suitable for impregnating various winding materials such as fibers, fiber bundles, tapes, and complex cross-sections in the winding forming process. Glue processing. Background technique [0002] The dipping process is an important link in the winding molding process, which determines the degree of penetration, fiber strength and glue content of the winding molding products. Among them, the glue content has a great impact on the performance of the winding products, and the glue content not only affects the quality of the winding products And thickness, when the glue content is too high, it will also reduce the strength of the winding product, and the glue flow will be serious during molding and curing. When the glue content is too low, the porosity of the winding product will increase, and the compactness, aging resistance, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C53/80
CPCB29C53/8066
Inventor 王泽震吴庆堂修冬王凯吴焕侯楠赵国法康战魏巍段学俊郭波李珊李旭应宇翔赵亮于瀛
Owner CHANGCHUN EQUIP TECH RES INST
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