Temperature sensor film, conductive film and manufacturing method thereof

A technology of temperature sensor and conductive film, which is applied in the field of conductive film, can solve the problems of cumbersome manufacturing process and high cost, and achieve the effect of high temperature measurement accuracy and large temperature coefficient of resistance

Pending Publication Date: 2022-05-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When measuring the temperature of multiple parts in the plane with a thermocouple or a chip thermistor, it is necessary to arrange a temperature sensor for each measurement point and connect each temperature sensor to a printed wiring board, etc., so the manufacturing process will change. cumbersome
In addition, in order to measure the temperature distribution in the plane, it is necessary to arrange many sensors on the substrate, which is a major cause of cost increase.

Method used

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  • Temperature sensor film, conductive film and manufacturing method thereof
  • Temperature sensor film, conductive film and manufacturing method thereof
  • Temperature sensor film, conductive film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] A roll of polyethylene terephthalate (PET) film (“Lumirror 149UNS” manufactured by Toray, surface arithmetic average roughness Ra: 1.6 nm) with a thickness of 150 μm was set in a roll-to-roll sputtering device, Exhaust the sputtering device to reach a vacuum of 5.0×10 -3 After Pa, a silicon thin film with a thickness of 5 nm, a silicon oxide thin film with a thickness of 10 nm, and a nickel thin film with a thickness of 270 nm were sequentially formed on the PET film by DC sputtering at a substrate temperature of 150°C. Si layer and SiO 2Layer formation used a B-doped Si target. For the Si layer, introduce argon as the sputtering gas, with a pressure of 0.3Pa and a power density of 1.0W / cm 2 conditions for film formation. For SiO 2 layer, in addition to argon as the sputtering gas, oxygen is also introduced as a reactive gas (O 2 / Ar=0.12 / 1.0), with a pressure of 0.3Pa and a power density of 1.8W / cm 2 conditions for film formation. The formation of the nickel fil...

Embodiment 2

[0097] The conductive film of Example 1 was heated in a hot air oven at 155° C. for 60 minutes to produce a conductive film.

Embodiment 3

[0105] The conductive film of Comparative Example 3 was heated in a hot air oven at 155° C. for 60 minutes to prepare a conductive film.

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Abstract

The invention provides a temperature sensor film which is provided with a patterned metal thin film on a resin film substrate and has high temperature measurement precision. A conductive film (102) for producing a temperature sensor film is provided with a nickel thin film (10) on one main surface of a resin film substrate (50). The nickel thin film preferably has a plane spacing of less than 0.2040 nm between the (111) planes of nickel. A temperature sensor film can be obtained by patterning a nickel film to form a temperature measurement resistor part and a lead part connected to the temperature measurement resistor part.

Description

technical field [0001] The present invention relates to a temperature sensor film provided with a patterned metal thin film on a resin film substrate, a conductive film for producing the temperature sensor film, and a method for producing the same. Background technique [0002] Multiple temperature sensors are used in electronic equipment. Temperature sensors are typically thermocouples or chip thermistors. When measuring the temperature of multiple parts in the plane with a thermocouple or a chip thermistor, it is necessary to arrange a temperature sensor for each measurement point and connect each temperature sensor to a printed wiring board, etc., so the manufacturing process will change. It is cumbersome. In addition, in order to measure the temperature distribution in the plane, it is necessary to arrange a plurality of sensors on the substrate, which is a factor of cost increase. [0003] Patent Document 1 proposes a temperature sensor film in which a metal film is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14G01K7/22H01B1/02H01B13/00
CPCH01B5/14H01B1/02G01K7/22H01B13/00H01B13/0026G01K2007/163G01K1/026G01K7/18C23C14/205C23C14/10G01K7/16G01K7/183G01K2217/00
Inventor 安井智史宫本幸大涩谷克则
Owner NITTO DENKO CORP
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