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Substrate for liquid ejection head and liquid ejection head

A technology of liquid ejection head and liquid discharge, applied in the direction of printing, etc., can solve the problems such as the reduction of the reliability of the interlayer insulating film of the inkjet head, and achieve the effect of inhibiting dissolution

Active Publication Date: 2022-05-13
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, the disadvantage is that the reliability of the inkjet head is lowered due to the dissolution of the interlayer insulating film

Method used

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  • Substrate for liquid ejection head and liquid ejection head
  • Substrate for liquid ejection head and liquid ejection head
  • Substrate for liquid ejection head and liquid ejection head

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0042] Hereinafter, the present disclosure will be specifically described with reference to examples, but the present disclosure is not limited to these examples.

[0043] Si according to the present disclosure w o x C y N z The film-forming conditions of the film are appropriately selected from the following.

[0044] SiH 4 Gas flow: 0.02 to 0.3slm

[0045] N 2 O gas flow: 0.1 to 3slm

[0046] CH 4 Gas flow: 0.1 to 5slm

[0047] HRF power: 100 to 900W

[0048] LRF power: 8 to 500W

[0049] Pressure: 100 to 700Pa

[0050] Temperature: 300 to 450°C

[0051] By adjusting these conditions and changing the process gas SiH 4 , N 2 O and CH 4 flow ratio, Si with different composition ratios can be obtained w o x C y N z membrane. As a result, Si of levels A to K shown in Table 1 were obtained w o x C y N z membrane. In this specification, Si w o x C y N z The content ratio of each element in the film is represented by atomic percent (atomic %). Si forme...

experiment example 1

[0056] The following experiments were performed to confirm that each Si w o x C y N z Corrosion resistance of the film to ink. First, each Si is formed on a silicon substrate w o x C y N z membrane. Thereafter, it is formed with Si w o x C y N z The substrate of the film was cut to a size of 20 mm x 20 mm. The slices were dipped in 30 ml of pigment ink with a pH of about 9, heated at 60° C. and left for 72 hours to check the amount of dissolution. In the above experiment, the back and side surfaces of the substrate were protected with an ink-insoluble resin, thereby eliminating the influence of dissolution of Si exposed to the end and back surfaces of the substrate. In this experimental example, the film thickness was measured by using a spectroscopic ellipsometer.

[0057] In this experiment, Si was confirmed by examining the change in film thickness w o x C y N z Corrosion resistance of the film to ink. The results are shown in Table 2. As the standard of...

experiment example 2

[0063] The following experiments were performed to confirm that each of the above Si w o x C y N z electrical insulation of the film. First, on a silicon substrate on which a silicon thermally oxidized film with a film thickness of 1 μm is formed, a metal layer mainly made of aluminum is formed so as to have a thickness of 200 nm, and processed so as to have a size of 2.5 mm×2.5 mm, with as the first electrode. Form a Si with a thickness of 300 nm on the first electrode w o x C y N z film, and a metal layer containing aluminum as a main material was formed thereon as a second electrode. The metal film has a thickness of 200 nm and a shape of 2 mm×2 mm, and is formed so as not to protrude from a region immediately above the first electrode. Then, in Si w o x C y N z A through hole is opened in the film for making electrical contact with the first electrode. Using such samples, the amount of current was measured when a voltage of 32 V was applied between the first ...

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Abstract

The invention relates to a substrate for a liquid ejection head and a liquid ejection head. A substrate for a liquid ejection head includes a base material, a heat-generating element including a heat-generating resistor layer for generating heat energy for discharging a liquid, a wiring layer for supplying power to the heat-generating element, and an interlayer insulating film for insulating the heat-generating resistor layer from the wiring layer. A part of a first interlayer insulating film for insulating a heat-generating resistor layer and a first wiring layer adjacent to the heat-generating resistor layer and a part of a second interlayer insulating film for insulating the first wiring layer and a second wiring layer adjacent to the second interlayer insulating film are formed by SiwOxCyNz (w + x + y + z = 100 (at%), 37 < = w < = 60 (at%), 30 < = x < = 53 (at%), 6 < = y < = 29 (at%), and 4 < = z < = 9 (at%)).

Description

technical field [0001] The present disclosure relates to a substrate for a liquid ejection head and a liquid ejection head. Background technique [0002] One of recording methods using a general inkjet head as a liquid ejection head is a method of heating and bubbling ink by means of a heating element and ejecting the ink by utilizing the bubbles. [0003] Japanese Patent Application Laid-Open No. 2016-137705 discloses the use of an insulator such as SiO as an interlayer insulating film for electrically insulating a plurality of electrical wiring layers or between an electrical wiring layer and a heat-generating resistance element. [0004] In the inkjet head using SiO applied to the interlayer insulating film disclosed in Japanese Patent Application Laid-Open No. 2016-137705, when ink invades into the inside of the substrate for liquid ejection head due to accidental disconnection or the like When the inkjet head is used for a long period of time, the interlayer insulating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14
CPCB41J2/14B41J2/14129B41J2/1603B41J2/1642B41J2/14088B41J2/05B41J2/14032B41J2202/03
Inventor 广原真依高桥健治
Owner CANON KK
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