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Heating sheet and manufacturing method thereof, heating tape and semiconductor manufacturing equipment

A technology for manufacturing equipment and manufacturing methods, which is applied in the field of heating sheet and its manufacturing, heating belt and semiconductor manufacturing equipment, and can solve problems such as short-circuit heating and unevenness

Pending Publication Date: 2022-05-20
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a heating sheet and its manufacturing method, heating belt and semiconductor manufacturing equipment, which are used to solve the problems of short circuit and uneven heating caused by the offset of the heating wire in the heating belt

Method used

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  • Heating sheet and manufacturing method thereof, heating tape and semiconductor manufacturing equipment
  • Heating sheet and manufacturing method thereof, heating tape and semiconductor manufacturing equipment
  • Heating sheet and manufacturing method thereof, heating tape and semiconductor manufacturing equipment

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Embodiment Construction

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indic...

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Abstract

The invention discloses a heating sheet and a manufacturing method thereof, a heating belt and semiconductor manufacturing equipment, relates to the technical field of semiconductor equipment, and aims to solve the problems of short circuit and non-uniform heating caused by deviation of a heating wire in the heating belt from a preset position. The heating sheet comprises a first insulating film, an electric heating wire structure deposited and formed on the first insulating film, and a second insulating film. And the second insulating film is formed on the first insulating film and is used for at least filling gaps in the electric heating wire structure.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a heating sheet, a manufacturing method thereof, a heating belt and semiconductor manufacturing equipment. Background technique [0002] During the semiconductor manufacturing process, the semiconductor manufacturing equipment is equipped with a vacuum chamber, and the vacuum chamber is connected with a pipeline, and the gas is transported into the vacuum chamber through the pipeline to participate in the reaction. After the reaction, the by-products generated by the reaction need to be transported out of the vacuum chamber. On the outer periphery of the pipeline, there is often a heating belt for heating the pipeline. [0003] In the heating belt provided by the related art, a heating wire is used as a heat source inside, and the heating wire is fixed on a heat-resistant fabric by sewing. As the size of the heating strips decreases, the spacing between the heati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/20H05B3/36H05B3/28H01L21/67
CPCH05B3/20H05B3/36H05B3/28H01L21/67011
Inventor 金根浩周娜李俊杰王佳李琳
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI