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Wafer structure

A wafer and chip technology, applied in the direction of printing, inking devices, etc., can solve the problems of wasting blank area, unable to effectively reduce manufacturing costs, waste, etc.

Pending Publication Date: 2022-05-27
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the printable area (printing swath) of the inkjet chip on a wafer structure below 6 inches exceeds 1 inch (inch) or the page width printable area (printing swath) A4 size (8.3 inches (inch)) In order to produce higher high-resolution and higher-speed printing printing quality requirements, the number of required inkjet chips will be quite limited, and the number is less, compared to the wafer structure with a limited area below 6 inches. If the required inkjet chip is produced on a wafer structure with a limited area below 6 inches, the remaining blank area will be wasted, and these blank areas will occupy more than 20% of the entire wafer area, which is quite wasteful. Manufacturing costs cannot be effectively reduced

Method used

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Embodiment Construction

[0068] Embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

[0069] see figure 2 As shown, the present application provides a wafer structure 2 , which includes: a chip substrate 20 and a plurality of inkjet chips 21 . The chip substrate 20 is a silicon substrate, which is manufactured by a semiconductor process. In a specific embodiment, the chip substrate 20 may be fabricated using a semiconductor process of a 12-inch (inch) wafer; or, in another specific embodiment, the chip substrate 20 may be fabricated using a semiconductor process of a 16-inch (inch) wafer. Process produced.

[0070] The above-mentioned plurality of inkjet chips...

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Abstract

A wafer structure includes: a chip substrate; the at least one ink jet chip comprises a plurality of ink droplet generators; each ink droplet generator further comprises a thermal barrier layer, a heating resistance layer and a protection layer, the thermal barrier layer is formed on the chip substrate, the heating resistance layer is formed on the thermal barrier layer, a part of the protection layer is formed on the heating resistance layer, the barrier layer is formed on the protection layer, and the thermal barrier layer is formed on the chip substrate. The bottom of the ink supply chamber is communicated with the protective layer, the top of the ink supply chamber is communicated with the spray hole, the thickness of the thermal barrier layer is equal to the thickness of the protective layer, the thickness of the heating resistance layer is equal to the length of the heating resistance layer, the length of the heating resistance layer is 5-30 microns (mu m), and the width of the heating resistance layer is 5-10 microns (mu m).

Description

【Technical field】 [0001] This case relates to a wafer structure, especially a wafer structure for producing inkjet chips suitable for inkjet printing by semiconductor process. 【Background technique】 [0002] In addition to laser printers, inkjet printers are another widely used type of printers currently on the market. They have the advantages of low price, easy operation and low noise, and can print on various types of paper such as paper and photo paper. Inkjet media. The printing quality of an inkjet printer mainly depends on factors such as the design of the ink cartridge. In particular, the design of the inkjet chip to release ink droplets to the inkjet medium is an important consideration in the design of the ink cartridge. [0003] like figure 1 As shown, the inkjet chips produced in the current inkjet printing market are made from a wafer structure by a semiconductor process, and the current inkjet chips 1' are produced with a wafer structure below 6 inches; howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14
CPCB41J2/14B41J2/14145B41J2/14129B41J2002/14459B41J2/14024B41J2/1635B41J2202/11B41J2202/13B41J2/14112B41J2/14016
Inventor 莫皓然张英伦戴贤忠韩永隆黄启峰谢锦文
Owner MICROJET TECH