Intelligent chip packaging box based on big data

Abstract

The invention relates to the technical field of intelligent chip packaging boxes, in particular to a big-data-based intelligent chip packaging box which comprises a packaging box body, and the left side and the right side of the packaging box body fixedly communicate with air pressure sleeves. A sealing top plate used for sealing the packaging box body and the air pressure sleeve is arranged on the top of the packaging box body and the top of the air pressure sleeve. The chip packaging box has the function of controlling the internal environment of the containing box in real time, it is guaranteed that the chip is in a proper environment all the time, vacuum packaging operation is not needed, the chip is provided with the detector used for monitoring the state of the chip, the state of the internal chip can be directly known from the display screen, and the chip packaging box is convenient to use. According to the utility model, the fault chip can be rapidly discharged, and the linkage piece used for adsorbing the single chip is arranged in the placing process, so that the stability and the safety of the chip can be always maintained in the transportation or storage process.

Description

technical field [0001] The invention relates to the technical field of smart chip packaging boxes, in particular to a smart chip packaging box based on big data. Background technique [0002] Chips, especially high-end chips, are of high value but are easily damaged or failed, and have extremely high requirements for their packaging protection. The chip is used as a humidity-sensitive component, and some components are easily oxidized and need to be stored in a low-humidity environment or even a low-oxygen environment. At present, the main form of chip packaging in the packaging and testing industry is: the chip is loaded in an injection tray, and then placed in an aluminum foil bag with a desiccant or a similar high-barrier vacuum packaging bag, and the bag is evacuated and then packed. The bag mouth is heat-sealed, wrapped with cushioning material, and then packed into a carton. [0003] The existing chip packaging boxes are simple. Although some packaging boxes are conn...

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Problems solved by technology

[0003] The existing chip packaging box is simple. Although some packaging boxes are connected with big data, they are only used to position the box to ensure the safety of the box. Before placing the chip, the chip needs to be protected, which makes the chip packaging and transportation The operation in the process is cumbersome, and the defective rate of the chip will increase during the packaging process, and the number of chips placed in the packaging box is limited, mainly clamped in the clamping groove set separately, and the internal environment will change with the time of placement. changes, and cannot be adjusted in real time. During transportation, due to the instability and shaking of the box, the internal chip is prone to shaking. Moreover, when the chip is in use, it is necessary to test the unpacked chip to rule out the Chip failure, this operation is very troublesome, and it is impossible to observe the status of the internal chip in real time

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