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A chip packaging structure and packaging method with electromagnetic shielding function

An electromagnetic shielding and chip packaging technology, which is applied to circuits, electrical components, transportation and packaging, etc., can solve the problems of electronic equipment not working normally, not having electromagnetic shielding function, and product performance is uneven, so as to reduce the failure of equipment to work normally. Work or failure, not easy to electromagnetic interference, not easy to chip damage

Active Publication Date: 2022-07-26
GUANGDONG CHIPPACKING TECH
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the popularization of electronic equipment, the demand for chips used to realize circuit control or specific functions has increased significantly; production has also increased, but product performance is uneven; Among them, there is no electromagnetic shielding function, which makes the chip very prone to failure and the electronic equipment cannot work normally; therefore, there is a lack of a chip packaging process with electromagnetic shielding function

Method used

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  • A chip packaging structure and packaging method with electromagnetic shielding function
  • A chip packaging structure and packaging method with electromagnetic shielding function
  • A chip packaging structure and packaging method with electromagnetic shielding function

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Embodiment Construction

[0076] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

[0077] according to Figure 1-6 As shown, an embodiment of the present invention provides a chip packaging method with an electromagnetic shielding function, including the following steps:

[0078] Prepare a heat sink 1 with insulating bumps 2, and bond metal pins 3 on the insulating bumps 2;

[0079] Adhere the chip module 6 to the side of the heat sink 1 with the insulating protrusion 2;

[0080] Use the wire harness to electrically connect the pins of the chip module 6 and the metal pins 3 on the insulating protrusions 2;

[0081] The shielding shell 8 is welded to the end of the insulating protrusion 2 away from the heat sink 1 , and the shielding shell 8 and the heat sink...

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Abstract

The invention provides a chip packaging method with electromagnetic shielding function, comprising the following steps: preparing a heat sink with insulating bumps, and bonding metal pins on the insulating bumps; bonding a chip module on the heat sink with The side of the insulating bump; use the wire harness to electrically connect the pins of the chip module and the metal pins on the insulating bump; solder the shielding shell to the end of the insulating bump away from the heat sink, and plastic-encapsulate the shield shell and the heat sink to obtain Chip finished product. The invention is used to improve the production and preparation process in the chip manufacturing process, so that the chip can have the electromagnetic shielding function, thereby improving the product performance, and reducing the equipment can not work normally or malfunction caused by electromagnetic interference during the working process of the chip. Case.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and packaging method with electromagnetic shielding function. Background technique [0002] With the popularization of electronic equipment, the demand for chips used to realize circuit control or specific functions has increased significantly; the production volume has also increased, but the product performance is uneven; for example, the existing chips are in the actual use process. It does not have the electromagnetic shielding function, so that the chip is very prone to failure and the electronic equipment cannot work normally; therefore, there is a lack of a chip packaging process that can have the electromagnetic shielding function. SUMMARY OF THE INVENTION [0003] The invention provides a chip packaging structure and packaging method with electromagnetic shielding function, which are used to improve the production and preparation proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/52H01L21/56H01L21/67H01L21/677H01L23/552H01L23/31H01L23/367
CPCH01L21/52H01L21/56H01L23/552H01L23/3672H01L23/3107H01L21/67121H01L21/67721H01L21/67259
Inventor 程浪陈勇张怡饶锡林黄乙为
Owner GUANGDONG CHIPPACKING TECH
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