Heat-curable magnetic epoxy resin powder and inductor packaging method thereof

Abstract

The invention discloses a heat-curable magnetic epoxy resin powder coating and an inductor packaging method thereof. The heat-curable magnetic epoxy resin powder coating is characterized by containing the following substances in percentage by weight: 30 to 50 percent of epoxy resin, 20 to 50 percent of soft magnetic ferrite powder, 10 to 20 percent of a composite curing agent, 5 to 8 percent of a filler and 3 to 8 percent of an assistant. The method comprises the following steps: proportionally mixing the epoxy resin, the soft magnetic ferrite powder, the composite curing agent, the filler and the assistant, performing uniform stirring by virtue of stirring equipment, preparing a flaky dry material, crushing the flaky dry material, impregnating a preheated inductor in obtained powder by virtue of fluidized coating equipment, and performing baking, cooling and packaging. The heat-curable magnetic epoxy resin powder coating and the inductor packaging method thereof have the advantages that the powder has high flowability under the driving of airflow, so that packaging is facilitated without adhesion; the material cost is reduced, and the prepared coating can be easily stored for long; the production efficiency can be improved, the coating can be kept uniform, and the product is stable in inductance and small in error change; the inductance can be increased, the coating can be endowed with an electromagnetic shielding function, and flux leakage is avoided; the saturation resistance of current is improved; the heat-curable magnetic epoxy resin powder coating and the inductor packaging method thereof are applied to improvement of packaging of a vertical plug-in inductor and a packaging material.

Description

technical field [0001] The invention relates to a method for preparing thermosetting magnetic epoxy resin powder and encapsulating inductors. Background technique [0002] With the miniaturization of electronic products, the advent of various high-definition displays and the popularization of low-cost LED lighting products, there are higher requirements for existing inductors. When in use, it is required that its inductance value remains unchanged while its ability to superimpose direct current remains unchanged. Moreover, a shielding function is required to reduce the interference of the electromagnetic field generated by the inductance device on other components. Secondly, in the field of security, such as alarms and buzzer booster circuits, when producing inductors for boosting, due to space constraints, some products need to be horizontally formed with 90-degree 'L'-shaped bends, resulting in Products with high inductance value use thin copper wires and many turns. Wh...

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Problems solved by technology

[0003] The problem to be solved by the present invention is that after the H-shaped inductance of the thin copper wire with high inductance value is encapsulated with a magnetic epoxy resin solvent, during the forming process of the inductance pin and the magnetic core with a 90-degree 'L'-shaped folding foot, because the packaging material is in the The hardness after drying is insufficient, and the problem of disconnection is still unavoidable. The purpose is to provide a low-cost high-hardness magnetic epoxy resin powder packaging material with electromagnetic shielding function and its method for packaging inductors, thereby improving production. Efficiency, lower material cost, less paint waste, and also has electromagnetic shielding function after the coating is dried