Unlock instant, AI-driven research and patent intelligence for your innovation.

Device capable of arranging silicon wafers in fixed rows during reaction in chemical solution

A chemical and reaction technology, applied in the field of solar photovoltaics, can solve problems such as easy accumulation at the bottom of the tank, adverse effects on product quality, and inability to discharge sediments in time, so as to optimize the process, improve the overall yield, and improve the appearance Effect

Pending Publication Date: 2022-06-03
江苏润阳悦达光伏科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a device that can be used to arrange the silicon wafers when they react in a chemical solution. By installing a waste discharge device, a switch button and a filter device, it solves the current problem in the processing of crystalline silicon solar cells. During the production process, silicon wafers are discharged through internal circulation during wet machine texturing and polishing. The sediment produced by the reaction between silicon wafers and chemicals cannot be discharged in time, and it is easy to accumulate at the bottom of the tank, which will adversely affect product quality.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device capable of arranging silicon wafers in fixed rows during reaction in chemical solution
  • Device capable of arranging silicon wafers in fixed rows during reaction in chemical solution
  • Device capable of arranging silicon wafers in fixed rows during reaction in chemical solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] see Figure 1-4 , the embodiment of the present invention provides a technical solution: a device for arranging silicon wafers when they react in a chemical solution, including a box body 1, a bottom tank 2, a base 3, a waste discharge device 4, a filter device 5, a rotating shaft 6. The waste discharge port 10 of the outer groove and the waste discharge port 12 of the bottom groove 2. The bottom groove 2 is provided below the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a device capable of regularly discharging silicon wafers during reaction in a chemical solution, the device comprises a box body, a bottom groove, a waste discharge device, a filtering device, an outer groove waste discharge port and a bottom groove waste discharge port, the filtering device is arranged below the bottom groove, the filtering device comprises a filter screen, a fixing block and a handle, bases are arranged on two sides of the filtering device, and the outer groove waste discharge port and the bottom groove waste discharge port are arranged on the base. The bottom groove is connected with the waste discharging device in an embedded mode, the bottom of the waste discharging device is fixedly connected with the motor, the motor is connected with the rotating column in an embedded mode, the rotating column is connected with the fan blades in a welded mode, and sediment generated when silicon wafers react with chemicals can be discharged in a circulating mode through operation of the switch button. According to the device, the process can be optimized, the appearance of the silicon wafer is obviously improved, the overall yield and efficiency of a workshop can be improved, the device is reasonable in structure and convenient and rapid to operate, the appearance of the silicon wafer can be optimized, the efficiency and the yield can be improved, and the device has extremely high use value and popularization value.

Description

technical field [0001] The invention relates to the technical field of solar photovoltaics, in particular to a device that can be used for arranging silicon wafers when they react in chemical solutions. Background technique [0002] The content of silicon in the earth's crust reaches 25.8%, which provides an inexhaustible source for the production of single crystal silicon. Since silicon is one of the most abundant elements in the earth's crust, it is destined to enter the large-scale market for solar cells ( For the products of massmarket), the advantage of reserves is also one of the reasons why silicon has become the main material of photovoltaics; [0003] At present, during the processing and production of crystalline silicon solar cells, the silicon wafers are discharged through internal circulation during texturing and polishing in the wet machine, and the precipitates generated by the reaction between the silicon wafers and chemicals cannot be discharged in time, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L21/67
CPCH01L31/1876H01L21/67017H01L21/67023Y02P70/50
Inventor 胡亚洲王超宋文祥张帅王震
Owner 江苏润阳悦达光伏科技有限公司