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Electromagnetic shielding film and circuit board

A technology of electromagnetic shielding film and circuit board, which is applied in the field of electronics, can solve problems such as large application, overflow, and poor appearance of circuit boards, and achieve the effect of improving shielding efficiency and good appearance

Pending Publication Date: 2022-06-21
GUANGZHOU FANGBANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventor found in the process of implementing the present invention that there are the following technical problems in the prior art: in the process of pressing the existing electromagnetic shielding film to the circuit board, in order to allow the shielding layer to have a The roughness can effectively pierce the adhesive film layer and connect with the ground layer of the circuit board. It often needs to apply a large pressing force. In this process, the glue of the adhesive film layer is easy to overflow from the edge between the electromagnetic shielding film and the circuit board. This will cause the problem of poor appearance of the circuit board; and in order to prevent the glue of the film layer from easily overflowing from the edge between the electromagnetic shielding film and the circuit board during the pressing process of the electromagnetic shielding film, the amount of glue in the film layer can be reduced Or apply a small pressing force, but both of these methods will easily cause delamination and explosion between the electromagnetic shielding film and the circuit board, especially when the thickness of the adhesive film layer is not reduced. The small pressing force applied by the film may also make the shielding layer unable to effectively penetrate the adhesive film layer, resulting in the inability to achieve contact connection between the shielding layer and the ground layer of the circuit board, thus making the shielding effectiveness of the electromagnetic shielding film lower
It can be seen that the existing electromagnetic shielding film cannot have the following advantages at the same time: good shielding effect, good adhesive strength with the circuit board and good appearance of the circuit board after being pressed to the circuit board

Method used

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  • Electromagnetic shielding film and circuit board
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  • Electromagnetic shielding film and circuit board

Examples

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Effect test

preparation example Construction

[0062] Specifically, when the electromagnetic shielding film includes a carrier layer 1, an insulating layer 2, a shielding layer 3, an adhesive film layer 4 and a protective film layer 5, the preparation method of the electromagnetic shielding film includes:

[0063] 1) Prepare carrier layer 1;

[0064] 2) forming an insulating layer 2 on one side of the carrier layer 1;

[0065] 3) forming a shielding layer 3 on the side of the insulating layer 2 away from the carrier layer 1;

[0066] 4) Coating glue on the side of the shielding layer 3 away from the insulating layer 2 to form the glue film layer 4;

[0067] 5) The protective film layer 5 is attached to the side of the adhesive film layer 4 away from the shielding layer 3 .

Embodiment 1

[0070] An electromagnetic shielding film, comprising a shielding layer and an adhesive film layer; the adhesive film layer is arranged on one side of the shielding layer; wherein, the roughness Rz of the side of the shielding layer close to the adhesive film layer is 1 micrometer, the glue gram weight parameter of the adhesive film layer is 0.5 grams per square decimeter, the roughness Rz of the side of the shielding layer close to the adhesive film layer and the glue gram weight parameter of the adhesive film layer are both The scale of the values ​​is 2.

[0071] Test result: After the electromagnetic shielding film of this embodiment is pressed onto the circuit board, after testing, the grounding resistance between the shielding layer of the electromagnetic shielding film of this embodiment and the ground layer of the circuit board is less than 213mΩ. Moreover, the good peel strength between the electromagnetic shielding film of this embodiment and the circuit board is grea...

Embodiment 2

[0074] An electromagnetic shielding film, comprising a shielding layer and an adhesive film layer; the adhesive film layer is arranged on one side of the shielding layer; wherein, the roughness Rz of the side of the shielding layer close to the adhesive film layer is 15.1 micrometer, the glue gram weight parameter of the adhesive film layer is 0.1 grams per square decimeter, the roughness Rz of the side of the shielding layer close to the adhesive film layer and the glue gram weight parameter of the adhesive film layer are both The scale of the values ​​is 151.

[0075] Test results: After the electromagnetic shielding film of this embodiment is pressed onto the circuit board, after testing, the grounding resistance between the shielding layer of the electromagnetic shielding film of this embodiment and the ground layer of the circuit board is less than 78mΩ. Moreover, the good peel strength between the electromagnetic shielding film of this embodiment and the circuit board is...

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Abstract

The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film and a circuit board wherein the electromagnetic shielding film comprises a shielding layer and an adhesive film layer; the adhesive film layer is arranged on one surface of the shielding layer; wherein under the condition that the unit of the roughness Rz is micron and the unit of the adhesive gram weight parameter is gram per square decimeter, the ratio of the roughness Rz of one surface, close to the adhesive film layer, of the shielding layer to the numerical value of the adhesive gram weight parameter of the adhesive film layer is 2-300. The electromagnetic shielding film and the circuit board provided by the invention have the advantages of good shielding effectiveness, good bonding strength with the circuit board and good appearance of the circuit board after being pressed on the circuit board.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electromagnetic shielding film and a circuit board. Background technique [0002] With the rapid development of the electronic industry, electronic products are further developed towards miniaturization, light weight, and high assembly density, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in mobile phone, liquid crystal display, communication and aerospace industries. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is Electromagnetic Interference Shielding (EMI Shielding). With the integration of functions of communication equipment such as mobile phones, the inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K1/02
CPCH05K9/0084H05K1/0216H05K2201/0715
Inventor 苏陟张美娟
Owner GUANGZHOU FANGBANG ELECTRONICS